Vera Yang is President and Co-Founder of Flexcompute, a frontier AI lab building a Physics World Model that bridges data-driven AI and the laws of physics. She focuses on the problems where the stakes are highest and the physics hardest, including photonic chips for AI data centers, advanced semiconductor packaging and spacecraft… Read More
Most of the AI conversation stops at the chip. At SEMICON West 2026 I sat down with René Jonker, Chief Product Officer of Soitec, to talk about what sits underneath it.
Ask an engineer where AI performance comes from and you will hear about process nodes, dataflow, HBM stacks and interconnect fabrics. Rarely about the wafer. Yet a … Read More
Welcome to the AMD Xilinx Security Working Group Registration Request Portal. This event is an annual multi-day FREE event in North America and Europe that brings together AMD Xilinx customers from all markets, Alliance Partners, government agencies, and authorities to discuss the latest security topics.
The unique aspect… Read More
Synopsys’ collaboration with AMD on the Instinct MI455X GPU highlights a shift in how advanced AI processors are developed. Increasing performance depends on coordinating compute dies, memory interfaces, packaging, power delivery, and software. According to Synopsys’ announcement, AMD used its design, verification, … Read More
Last year I wrote about Arteris’ introduction of multi-die support for coherent NoCs. This is a very big deal because hyperscalers and OEMs are now building large systems that depend on multi-chiplet architectures and require efficient traffic management between chiplets, in one case as many as 12 compute, fabric/cache and … Read More
SiFive and AMD demonstrated an AI workload that brings together two open technologies: the RISC-V processor architecture and AMD’s ROCm GPU software platform. At the AI Infra Summit on September 15, 2026, the companies showed ROCm 10.0 running on SiFive’s BigSky datacenter development server. SiFive P870-D CPUs served as the… Read More
TSMC reportedly plans to double its Chip-on-Wafer-on-Substrate capacity from approximately 130,000 300mm-equivalent wafers per month at the end of 2026 to 260,000 by 2028. The estimate is not formal company guidance and should be treated as a supply-chain projection. Nevertheless, the direction is consistent with TSMC’s… Read More
Phillip Stanley-Marbell is the founder and CEO of Signaloid. Up until September 2025, he was a full Professor (Chair of Physical Computation) in the Electrical Engineering Division of the Department of Engineering at the University of Cambridge, where he led the Physical Computation Laboratory. He completed his PhD at Carnegie… Read More
The global semiconductor market in the second quarter of 2026 was $368 billion, according to WSTS. 2Q 2026 set records for growth: up 35% from 1Q 2026 and up a phenomenal 104% from 2Q 2025. The previous record growth was set in 1Q 2026: up 25% from the prior quarter and up 79% from a year earlier.
Growth continues to be driven by AI. Memory… Read More
Here’s what the presentations selected for the 2026 Hot Chips Conference tell us about what Silicon Valley companies are doing these days.
The conference, running this week at Stanford’s Memorial Auditorium, doesn’t publish detailed abstracts ahead of time, but the program itself, just the lineup of who’s presenting what, … Read More
