👉 This is Part 2 of an editorial series on the evolving economics of AI inference. If you missed Part 1, where I broke down the shift toward full-system integration, the lessons from the AI Infra Summit, and the “no forks” open-source philosophy, you can read it HERE: Beyond the Accelerator: Why Silicon Challengers … Read More
Of the three types of materials used in microelectronics – i.e., semiconductors, metals, and dielectrics – the first two often get the most attention. Yet, there is a pressing need for a rich variety of dielectric materials in device fabrication and interconnect isolation to satisfy the performance, power, and reliability … Read More
Some of Intel’s technology posts make some pretty specific statements and I have seen a number of posts where people seem to have misinterpreted what Intel was actually saying.
Multi Patterning
I have seen a lot of confusion on this one with some people saying Intel didn’t use multi patterning at 22nm and others saying Intel used … Read More
