Tag: AI

Webinar: From Waveforms to AI: Simulating 6G Before It Exists (America’s Session)

Webinar: From Waveforms to AI: Simulating 6G Before It Exists (America’s Session)
by Admin on 09-03-2026 at 1:59 am

September 24, 2026 | 10:00 AM PDT

6G standardization is accelerating: 3GPP RAN1 is actively evaluating candidate waveforms, new duplexing schemes, and advanced channel coding proposals, with each organization running proprietary simulators under subtly different assumptions. This makes direct comparison of results nearly

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Webinar: The future of systems engineering: How SysML v2 and generative AI transform engineering

Webinar: The future of systems engineering: How SysML v2 and generative AI transform engineering
by Admin on 09-03-2026 at 1:51 am

Engineering teams are dealing with increasing system complexity, stricter integration requirements and the shift toward software-defined products. Generative AI is emerging as a valuable capability, but it is not sufficient on its own.

To manage complexity and convergence across software and hardware, organizations need… Read More

PDF Solutions CONNECT 2026 Conference

PDF Solutions CONNECT 2026 Conference
by Admin on 09-03-2026 at 12:38 am

ABOUT THE CONFERENCE

Where Analytics Meets Innovation

Introducing Exensio® Aurora — AI-first, highly scalable architecture for Exensio Analytics.

At PDF Solutions CONNECT, we’ll introduce Exensio Aurora, a purpose-built solution architecture designed to handle semiconductor manufacturing data at petabyte scale

… Read More

Webinar: From Copper to COUPE: Scaling AI Interconnects with Co-Packaged Optics

Webinar: From Copper to COUPE: Scaling AI Interconnects with Co-Packaged Optics
by Admin on 09-02-2026 at 10:37 pm

Featured Speakers:

  • Igor Elkanovich, CTO, GUC
  • Sheng-Fan Yang, Director, GUC
  • Madhumita Sanyal, Sr. Director Product Management, Synopsys

Co-packaged optics (CPO) breaks through the data movement constraint by moving optical engines next to the XPU, reducing electrical reach from centimeters to millimeters and delivering

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Synopsys Wins the AI Silicon Brain Drain

Synopsys Wins the AI Silicon Brain Drain
by Daniel Nenni on 08-25-2026 at 4:00 pm
Categories: EDA, Synopsys
2 Comments

Synopsys Wins the AI SIlicon Brain Drain

The reported move of Amit Gupta, Jeff Dyck, and Ryan Silk from Siemens EDA to Synopsys matters because this is more than a routine transfer of experienced executives and engineers. Together, the three represent a concentrated body of expertise in applying artificial intelligence to semiconductor design—one of the most strategically… Read More

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Optimizing for Thermoelastic in Package and PCB Design from the Outset

Optimizing for Thermoelastic in Package and PCB Design from the Outset
by Bernard Murphy on 08-25-2026 at 6:00 am
Categories: 3D IC, AI, Chiplet, EDA, Vinci

Vinci image

Signoff-quality design tools are mandatory for signoff, though not so good for early design exploration. Signoff demands high accuracy in design description and high precision in analysis. The first requirement can’t be met early in design where architecture decisions are still in flux, and the second depends on very detailed… Read More

Europe OIP Ecosystem Workshop

Europe OIP Ecosystem Workshop
by Admin on 08-24-2026 at 12:15 am

Join Us to Connect, Collaborate, and Shape the Future of AI

Get ready to immerse yourself in the future of semiconductor design at the 2026 TSMC Global Open Innovation Platform® (OIP) Ecosystem Forum! This isn’t just an event—it’s the ultimate collaborative hub where the world’s leading technology pioneers gather to discuss… Read More

Japan OIP Ecosystem Workshop

Japan OIP Ecosystem Workshop
by Admin on 08-24-2026 at 12:06 am

Join Us to Connect, Collaborate, and Shape the Future of AI

Get ready to immerse yourself in the future of semiconductor design at the 2026 TSMC Global Open Innovation Platform® (OIP) Ecosystem Forum! This isn’t just an event—it’s the ultimate collaborative hub where the world’s leading technology pioneers gather to discuss… Read More