Ceva is expanding the reach of its neural processing technology with a next-generation NeuPro portfolio designed to serve everything from always-on sensors to AI infrastructure. The announcement introduces four NPU families sharing a common architecture and unified software stack, giving semiconductor developers a consistent… Read More
Join us for a full day of digital transformation stories shared by our customers and industry experts, exploring how design, PLM, simulation, and AI are driving innovation across the entire product lifecycle.
Space programs need reliable thermal predictions and the ability to evaluate more electronics designs in less time.
This means that you need a smarter modelling strategy.
Why?
– Modeling layers explicitly does not mean better results
– Different analysis objectives require different modeling approaches
–… Read More
“IEEE CPMT Symposium Japan (ICSJ)” is one of the most widely recognized international conferences sponsored by the IEEE Electronics Packaging Society (EPS) and is held annually in Kyoto every November. This conference was inaugurated in 1992 as “The VLSI Packaging Workshop in Japan (VPWJ)” to provide… Read More
TGS offers a wonderful opportunity for networking, learning, and sharing
the latest technology developments with our community, as well as
meeting with Tower’s executives and team of experts.
Tower Semiconductor, a leading foundry for high-value analog semiconductor solutions, will host its flagship 2026 Technical Global… Read More
Manufacturing in northeastern Mexico is growing rapidly, driven by nearshoring, increasing production complexity, and the transition to advanced vehicle architectures. As electric vehicle (EV) technologies, software-defined vehicle (SDV) architecture, and artificial intelligence (AI) evolve, your testing strategies… Read More
Join Keysight’s EDA and Software Quality Engineering experts for an immersive day focused on the technologies shaping next-generation electronic and software systems.
From advanced RF and electromagnetic simulation to AI-driven design automation, photonics, power optimization, high-speed digital design, and… Read More
Webinar to explore device and transformer modeling, EM-extracted parasitics, and AI-assisted automation using the ADS MCP Server and Claude Code.
Power electronics and power converter design engineers, Magnetics, transformer, and component modeling engineers, Application,
AI is no longer just running on the system—it’s reshaping how the system is designed. Agentic AI is changing the demands on chips, architectures, memory, networking, software, and the entire compute stack. From AI-native silicon and advanced packaging to intelligent system architectures and autonomous design
Get ready to immerse yourself in the future of semiconductor design at the 2026 TSMC Global Open Innovation Platform ® (OIP) Ecosystem Forum ! This isn’t just an event—it’s the ultimate collaborative hub where the world’s leading technology pioneers gather to discuss … Read More
