electronica 2026by Admin on 06-16-2026 at 2:46 pm
electronica—Empowering the All Electric Society
Every two years, the world of electronics meets at electronica in Munich, Germany. As the world’s leading trade fair, it showcases the full range of technologies, products, and solutions that are empowering an All Electric Society (AES). Practice-oriented forums and… Read More
Advanced Packaging Summit 2026, under the theme “Packaging the Future of AI – From Silicon to Photon,” will examine the evolution of packaging technologies in the AI era and their broader implications for the semiconductor industry. Featuring presentations by leading industry experts, the summit will explore market shifts… Read More
Alchip Technologies reported improved financial results for the first quarter, reflecting continued momentum in advanced artificial intelligence (AI), high-performance computing (HPC), and custom ASIC demand. The company cited stronger customer engagement in leading-edge semiconductor designs and accelerating tape-out… Read More
As semiconductor manufacturing becomes increasingly knowledge-intensive, protecting intellectual property and trade secrets has emerged as a strategic imperative. The world’s leading foundry, TSMC is advancing beyond conventional information security practices by integrating artificial intelligence into… Read More
The semiconductor industry creates increasingly complex SoC and chiplets using lots of IP and all of that IP needs to be characterized at the cell level. As we design with 3nm and 2nm nodes, the sheer volume of data required for accurate static timing analysis (STA) is greatly increasing. Modern design flows rely on characterized… Read More
imec announced that IC-Link by imec has joined the TSMC 3DFabric Alliance, a strategically important move that reflects the semiconductor industry’s transition from traditional monolithic scaling toward heterogeneous integration, chiplet architectures, and advanced packaging-driven system optimization. The partnership… Read More
At CES 2026, Samsung called it a “companion.” Lenovo called it “ambient intelligence.” OpenAI spent $6.4 billion on a screenless device designed to be a continuous presence in your pocket. Meta acquired Limitless, the AI pendant that had been tracking everything its wearers said and heard. Every major consumer electronics company… Read More
L.C. leads efforts in design enablement, ensuring that the company can meet the diverse and evolving requirements of its global customer base. Prior to this, he headed the Design and Technology Platform organization starting in 2018.
Since joining TSMC in 2000, Dr. Lu has held multiple leadership positions in design services.… Read More
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Full-chip SoC debug has become one of the most expensive bottlenecks in modern verification. A single production issue can pull multiple engineers away days as they chase a failure through waveforms, logs, and across hundreds of thousands of lines of code.
In this webinar, we will demonstrate… Read More
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Embedded systems programs rarely fail because any one team lacks capability. They fail because critical engineering artifacts drift out of alignment over time and distance.
This includes requirements, architecture, implementation, verification, hardware bring-up, firmware,… Read More
