Ceva-XC21 and Ceva-XC23 DSPs: Advancing Wireless and Edge AI Processing

Ceva-XC21 and Ceva-XC23 DSPs: Advancing Wireless and Edge AI Processing
by Kalar Rajendiran on 03-25-2025 at 6:00 am

Cellular Evolution

Ceva recently unveiled its XC21 and XC23 DSP cores, designed to revolutionize wireless communications and edge AI processing. These new offerings build upon the Ceva-XC20 architecture, delivering unmatched efficiency, scalability, and performance for 5G-Advanced, pre-6G, and smart edge applications. As demand grows … Read More


Cutting Through the Fog: Hype versus Reality in Emerging Technologies

Cutting Through the Fog: Hype versus Reality in Emerging Technologies
by Kalar Rajendiran on 03-14-2025 at 8:00 am

Collage of three images

Silicon Catalyst is an organization that supports early-stage semiconductor startups with an ecosystem that provides tools and resources needed to design, create, and market semiconductor solutions. It is the only incubator + accelerator focused on the Global Semiconductor Industry and operates with the motto “It’s about… Read More


CEA-Leti Innovation Days – LID World Summit

CEA-Leti Innovation Days – LID World Summit
by Admin on 03-04-2025 at 8:18 pm

CEA-Leti’s flagship event

Beyond algorithms, what will it take for AI to realize its full potential for businesses and society? Advanced semiconductors!

Join global semiconductor industry leaders at LID World Summit 2025 for inspiring keynotes, insight-filled conferences, and exciting demos of what’s next in CEA-Leti’s

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TSMC Boston Technology Workshop 2025

TSMC Boston Technology Workshop 2025
by Admin on 03-04-2025 at 8:04 pm

Join us to get the latest on:

  • TSMC’s industry-leading HPC, Smartphone, IoT, and Automotive platform solutions to advance the AI future
  • TSMC’s advanced logic technology progress on 5nm, 4nm, 3nm, 2nm, A16 processes and beyond
  • TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC
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TSMC Austin Technology Workshop 2025

TSMC Austin Technology Workshop 2025
by Admin on 03-04-2025 at 8:01 pm

Join us to get the latest on:

  • TSMC’s industry-leading HPC, Smartphone, IoT, and Automotive platform solutions to advance the AI future
  • TSMC’s advanced logic technology progress on 5nm, 4nm, 3nm, 2nm, A16 processes and beyond
  • TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC
Read More

TSMC North America Technology Symposium 2025

TSMC North America Technology Symposium 2025
by Admin on 03-04-2025 at 7:59 pm

Join us to get the latest on:

  • TSMC’s industry-leading HPC, Smartphone, IoT, and Automotive platform solutions to advance the AI future
  • TSMC’s advanced logic technology progress on 5nm, 4nm, 3nm, 2nm, A16 processes and beyond
  • TSMC 3DFabric® advanced silicon stacking and packaging technology advancement on TSMC-SoIC
Read More

Powering the Future: How Engineered Substrates and Material Innovation Drive the Semiconductor Revolution

Powering the Future: How Engineered Substrates and Material Innovation Drive the Semiconductor Revolution
by Kalar Rajendiran on 03-03-2025 at 6:00 am

Substrate Vision Summit Engineered Substrate Panel Session

Engineered substrate technology is driving an evolution within the semiconductor industry. As Moore’s Law reaches its limits, the focus is shifting from traditional planar wafer scaling to innovative material engineering and 3D integration. Companies like Soitec, Intel and Samsung are pioneering this transition, unlocking… Read More