Synopsys Wins the AI Silicon Brain Drain

Synopsys Wins the AI Silicon Brain Drain
by Daniel Nenni on 08-25-2026 at 4:00 pm

Synopsys Wins the AI SIlicon Brain Drain

The reported move of Amit Gupta, Jeff Dyck, and Ryan Silk from Siemens EDA to Synopsys matters because this is more than a routine transfer of experienced executives and engineers. Together, the three represent a concentrated body of expertise in applying artificial intelligence to semiconductor design—one of the most strategically… Read More


Optimizing for Thermoelastic in Package and PCB Design from the Outset

Optimizing for Thermoelastic in Package and PCB Design from the Outset
by Bernard Murphy on 08-25-2026 at 6:00 am

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Signoff-quality design tools are mandatory for signoff, though not so good for early design exploration. Signoff demands high accuracy in design description and high precision in analysis. The first requirement can’t be met early in design where architecture decisions are still in flux, and the second depends on very detailed… Read More


Europe OIP Ecosystem Workshop

Europe OIP Ecosystem Workshop
by Admin on 08-24-2026 at 12:15 am

Join Us to Connect, Collaborate, and Shape the Future of AI

Get ready to immerse yourself in the future of semiconductor design at the 2026 TSMC Global Open Innovation Platform® (OIP) Ecosystem Forum! This isn’t just an event—it’s the ultimate collaborative hub where the world’s leading technology pioneers gather to discuss… Read More


Japan OIP Ecosystem Workshop

Japan OIP Ecosystem Workshop
by Admin on 08-24-2026 at 12:06 am

Join Us to Connect, Collaborate, and Shape the Future of AI

Get ready to immerse yourself in the future of semiconductor design at the 2026 TSMC Global Open Innovation Platform® (OIP) Ecosystem Forum! This isn’t just an event—it’s the ultimate collaborative hub where the world’s leading technology pioneers gather to discuss… Read More


TSMC 2026 North America OIP Ecosystem Forum

TSMC 2026 North America OIP Ecosystem Forum
by Admin on 08-24-2026 at 12:04 am

Join Us to Connect, Collaborate, and Shape the Future of AI

Get ready to immerse yourself in the future of semiconductor design at the 2026 TSMC Global Open Innovation Platform® (OIP) Ecosystem Forum! This isn’t just an event—it’s the ultimate collaborative hub where the world’s leading technology pioneers gather to discuss… Read More


Webinar: High-Level Synthesis Summer Hackathon: From Python to High-Performance AI Accelerators

Webinar: High-Level Synthesis Summer Hackathon: From Python to High-Performance AI Accelerators
by Admin on 08-18-2026 at 8:52 pm

Designing AI inference hardware for edge applications often requires building custom hardware accelerated solutions to meet the demands for ultra-low power consumption and strict real-time response requirements. This webinar introduces Catapult™ AI NN, which provides an automated flow that starts with a Python neural… Read More


Webinar: Cutting Full-Chip SoC Debug from Days to Minutes with AI

Webinar: Cutting Full-Chip SoC Debug from Days to Minutes with AI
by Admin on 08-17-2026 at 3:51 pm

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Full-chip SoC debug has become one of the most expensive bottlenecks in modern verification. A single production issue can pull multiple engineers away days as they chase a failure through waveforms, logs, and across hundreds of thousands of lines of code.

In this webinar, we will demonstrate… Read More