Broadcom’s fiscal third-quarter 2026 results show how artificial-intelligence infrastructure is shifting from general-purpose acceleration toward customized compute and large-scale networking. The company reported AI semiconductor revenue of $16.7 billion, up 221% year over year and 54% sequentially. That expansion… Read More
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Neural rendering. Offloading overloaded NPUs. Protection against evolving AI models. Developer-friendly programming. Reduced system complexity. There are many reasons why edge AI systems benefit from a GPU that delivers fast, efficient and fully programmable AI acceleration.… Read More
Daniel is joined by Mark Ren, founder and CEO of Agentrys. Mark has 26 years of EDA and AI R&D experience spanning IBM Research and NVIDIA Research, driving design automation innovations that power modern chip design. He received the IBM Corporate Award for contributions to the design closure for high-performance microprocessors.… Read More
Every chip ends its journey as a GDSII file — millions of polygons handed to the foundry. But hidden inside today’s layouts is a new kind of intelligence. AI is quietly reshaping physical design: guiding floorplanning and placement, predicting congestion and timing before a single wire is routed, and autonomously tuning… Read More
September 24, 2026 | 10:00 AM PDT
6G standardization is accelerating: 3GPP RAN1 is actively evaluating candidate waveforms, new duplexing schemes, and advanced channel coding proposals, with each organization running proprietary simulators under subtly different assumptions. This makes direct comparison of results nearly
Engineering teams are dealing with increasing system complexity, stricter integration requirements and the shift toward software-defined products. Generative AI is emerging as a valuable capability, but it is not sufficient on its own.
To manage complexity and convergence across software and hardware, organizations need… Read More
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Co-packaged optics (CPO) breaks through the data movement constraint by moving optical engines next to the XPU, reducing electrical reach from centimeters to millimeters and delivering
The reported move of Amit Gupta, Jeff Dyck, and Ryan Silk from Siemens EDA to Synopsys matters because this is more than a routine transfer of experienced executives and engineers. Together, the three represent a concentrated body of expertise in applying artificial intelligence to semiconductor design—one of the most strategically… Read More
Signoff-quality design tools are mandatory for signoff, though not so good for early design exploration. Signoff demands high accuracy in design description and high precision in analysis. The first requirement can’t be met early in design where architecture decisions are still in flux, and the second depends on very detailed… Read More
