The semiconductor industry has long depended on collaboration between technology developers, equipment suppliers and manufacturers. But as artificial intelligence reshapes computing, established ways of working together may no longer be sufficient. The next wave of innovation will depend not just on what companies develop,… Read More
Tag: AI
SEMICON West’s Autonomous Fab Vision Needs a Decision-Escalation Design
By Gleb Tsipursky
SEMICON West 2026’s smart-manufacturing agenda connected digital twins, agentic AI, physical AI, and increasingly autonomous factory operations. The final day included a session on automation and equipment for autonomous facilities. At its October CONNECT conference, PDF Solutions planned demonstrations… Read More
The Industry Challenge: AI Is Forcing Semiconductor Innovation Beyond the Chip
Applied Materials President and CEO Gary Dickerson with the EPIC Center founding partners on October 12, 2026, in Sunnyvale, CA. (Tomas Ovalle/AP Content Services for Applied Materials, Inc.)The bottlenecks are becoming interconnected
Artificial intelligence is changing what the semiconductor industry must deliver. … Read More
Virtual Mask Solutions Seminar 2026
Smarter Metrics, GPU Scale, and AI-Driven Workflows for Computational Lithography
At advanced nodes, observed defectivity, variability, and process-window behavior increasingly extend beyond what EPE and CD metrics can characterize. Closing that gap requires new ways to model, optimize, and measure patterning as well
Sir Arthur C. Clarke Deserves a Nobel Prize
By Richard Curtin
Ever since the Silicon Catalyst 2023 Semiconductor Industry Forum (“Welcome to our AI Wonderland”) I’ve been convinced that the Nobel Prize committee needs to consider awarding a posthumous award to Sir Arthur.
To remind you, Sir Arthur’s “2001: A Space Odyssey” movie was released in 1968. At that point in time… Read More
AI Infra Summit 10X 2027
TSMC’s AI Expansion Signals a Broader Shift in Computing
TSMC is describing an artificial intelligence boom that reaches beyond accelerator chips into the wider computing infrastructure needed to support increasingly capable AI systems. On the recent investor call, Chairman and CEO Dr. C.C. Wei presents strong demand, persistent supply constraints and an ambitious expansion … Read More
Webinar: The “bridge” to scale for AI and HPC applications
Designing high-performance multi-chiplet semiconductor packages for hyperscale, HPC and AI applications combines cutting-edge innovation with practical optimization. Embedded silicon bridge substrates enable cost-effective solutions by using base substrates such as organic laminates or redistribution-layer (RDL)… Read More
Rambus Design Summit 2026
Enabling Agentic AI: Memory, Interconnect and Security Solutions for Autonomous Intelligence
October 22, 2026 8:00 am – 1:30 pm PDT
About Event
Agentic AI is transforming computing systems into intelligent platforms capable of reasoning, planning, orchestrating tools, and acting autonomously. These new AI workloads… Read More
