The reported move of Amit Gupta, Jeff Dyck, and Ryan Silk from Siemens EDA to Synopsys matters because this is more than a routine transfer of experienced executives and engineers. Together, the three represent a concentrated body of expertise in applying artificial intelligence to semiconductor design—one of the most strategically… Read More
Tag: AI
Optimizing for Thermoelastic in Package and PCB Design from the Outset
Signoff-quality design tools are mandatory for signoff, though not so good for early design exploration. Signoff demands high accuracy in design description and high precision in analysis. The first requirement can’t be met early in design where architecture decisions are still in flux, and the second depends on very detailed… Read More
Europe OIP Ecosystem Workshop
Join Us to Connect, Collaborate, and Shape the Future of AI
Get ready to immerse yourself in the future of semiconductor design at the 2026 TSMC Global Open Innovation Platform® (OIP) Ecosystem Forum! This isn’t just an event—it’s the ultimate collaborative hub where the world’s leading technology pioneers gather to discuss… Read More
China OIP Ecosystem Forum
Join Us to Connect, Collaborate, and Shape the Future of AI
Get ready to immerse yourself in the future of semiconductor design at the 2026 TSMC Global Open Innovation Platform® (OIP) Ecosystem Forum! This isn’t just an event—it’s the ultimate collaborative hub where the world’s leading technology pioneers gather to discuss… Read More
Taiwan OIP Ecosystem Forum
Join Us to Connect, Collaborate, and Shape the Future of AI
Get ready to immerse yourself in the future of semiconductor design at the 2026 TSMC Global Open Innovation Platform® (OIP) Ecosystem Forum! This isn’t just an event—it’s the ultimate collaborative hub where the world’s leading technology pioneers gather to discuss… Read More
Japan OIP Ecosystem Workshop
Join Us to Connect, Collaborate, and Shape the Future of AI
Get ready to immerse yourself in the future of semiconductor design at the 2026 TSMC Global Open Innovation Platform® (OIP) Ecosystem Forum! This isn’t just an event—it’s the ultimate collaborative hub where the world’s leading technology pioneers gather to discuss… Read More
TSMC 2026 North America OIP Ecosystem Forum
Join Us to Connect, Collaborate, and Shape the Future of AI
Get ready to immerse yourself in the future of semiconductor design at the 2026 TSMC Global Open Innovation Platform® (OIP) Ecosystem Forum! This isn’t just an event—it’s the ultimate collaborative hub where the world’s leading technology pioneers gather to discuss… Read More
The Silicon Gold Rush
In-person attendance for this event is full. Join the in-person waitlist or sign up to watch the livestream.
Are AI chips the new frontier of computing? What happens when the world’s biggest cloud companies stop buying chips and start designing their own?
In this program, we’ll unpack how companies once defined by software are… Read More
Webinar: High-Level Synthesis Summer Hackathon: From Python to High-Performance AI Accelerators
Designing AI inference hardware for edge applications often requires building custom hardware accelerated solutions to meet the demands for ultra-low power consumption and strict real-time response requirements. This webinar introduces Catapult™ AI NN, which provides an automated flow that starts with a Python neural… Read More
Webinar: Cutting Full-Chip SoC Debug from Days to Minutes with AI
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Full-chip SoC debug has become one of the most expensive bottlenecks in modern verification. A single production issue can pull multiple engineers away days as they chase a failure through waveforms, logs, and across hundreds of thousands of lines of code.
In this webinar, we will demonstrate… Read More
