Synopsys Foundation IP for Intel 18A is a portfolio of semiconductor building blocks designed to help system-on-chip developers build advanced chips with better power, performance, and area, often called PPA. The offering includes embedded memory compilers, standard-cell logic libraries, and input/output libraries for… Read More
Tag: AI
Webinar: When Compute Outruns Data: Rethinking AI Connectivity
Featured Speaker:
- Manmeet Walia, Executive Director of Product Management, Synopsys
AI performance is no longer limited by compute—it’s limited by how efficiently data moves. As systems scale to compute-dense clusters, memory, die-to-die, and high-speed interfaces are emerging as critical bottlenecks.
This webinar explores… Read More
Webinar: Defacto is Boosting Front-end SoC Design With AI-Powered EDA tools
**Please register with professional email address**
As SoC design complexity grows and design windows shrink, EDA tools must evolve beyond traditional workflows. AI is the catalyst!
This webinar explores what the next generation of EDA tools and design platforms should look like when built with AI in the middle. We’ll… Read More
Webinar: Defacto is Boosting Front-end SoC Design With AI-Powered EDA tools
**Please register with professional email address**
As SoC design complexity grows and design windows shrink, EDA tools must evolve beyond traditional workflows. AI is the catalyst!
This webinar explores what the next generation of EDA tools and design platforms should look like when built with AI in the middle. We’ll… Read More
Semidynamics Brings Its Full Inference Stack to ISC HPC 2026 — And Why It Matters
AI inference is quickly becoming the real battleground for next-generation computing. Training still gets the headlines, but inference is where AI becomes a business, a service, and an infrastructure problem. Every chatbot response, agentic workflow, code assistant, scientific model, and enterprise copilot depends on … Read More
electronica 2026
electronica—Empowering the All Electric Society
Every two years, the world of electronics meets at electronica in Munich, Germany. As the world’s leading trade fair, it showcases the full range of technologies, products, and solutions that are empowering an All Electric Society (AES). Practice-oriented forums and… Read More
Advanced Packaging Summit 2026
Advanced Packaging Summit 2026, under the theme “Packaging the Future of AI – From Silicon to Photon,” will examine the evolution of packaging technologies in the AI era and their broader implications for the semiconductor industry. Featuring presentations by leading industry experts, the summit will explore market shifts… Read More
Alchip Accelerates on AI ASIC Demand
Alchip Technologies reported improved financial results for the first quarter, reflecting continued momentum in advanced artificial intelligence (AI), high-performance computing (HPC), and custom ASIC demand. The company cited stronger customer engagement in leading-edge semiconductor designs and accelerating tape-out… Read More
TSMC Pioneers a New Era in AI-Powered Trade Secret Management, Achieving Intelligent Innovation
As semiconductor manufacturing becomes increasingly knowledge-intensive, protecting intellectual property and trade secrets has emerged as a strategic imperative. The world’s leading foundry, TSMC is advancing beyond conventional information security practices by integrating artificial intelligence into… Read More
Library Characterization gets a Boost from AI
The semiconductor industry creates increasingly complex SoC and chiplets using lots of IP and all of that IP needs to be characterized at the cell level. As we design with 3nm and 2nm nodes, the sheer volume of data required for accurate static timing analysis (STA) is greatly increasing. Modern design flows rely on characterized… Read More
