EDA Interoperability at DAC

EDA Interoperability at DAC
by Daniel Payne on 06-17-2011 at 4:42 pm

Intro
My Wednesday breakfast at DAC last week was at the Interoperability event sponsored by Synopsys. The Synopsys moderator was so jovial that he reminded me of Jerry Lewis, I was relieved when the guests gave us an update.

Notes
Interconnect Modeling- Open Source Interconnect Technology Format (ITF)o Used by Star RC

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GlobalFoundries Production-Ready @ 28nm in Multiple Locations!

GlobalFoundries Production-Ready @ 28nm in Multiple Locations!
by Daniel Nenni on 06-15-2011 at 11:02 am

GLOBALFOUNDRIES showed off its 28nm design ecosystem at #48DAC last week in San Diego. The company featured a full design ecosystem for its 28nm High-k Metal Gate (HKMG) technology, including silicon-validated flows, process design kits (PDKs), design-for-manufacturing (DFM), and intellectual property (IP) in partnership… Read More


GLOBALFOUNDRIES 28nm Design Ecosystem!

GLOBALFOUNDRIES 28nm Design Ecosystem!
by Daniel Nenni on 06-01-2011 at 11:00 am

GLOBALFOUNDRIES will show off its 28nm design ecosystem at #48DAC next week in San Diego. The company will feature a full design ecosystem for its 28nm High-k Metal Gate (HKMG) technology, including silicon-validated flows, process design kits (PDKs), design-for-manufacturing (DFM), and intellectual property (IP) in partnership… Read More


3D IC @ #48DAC

3D IC @ #48DAC
by Daniel Nenni on 05-23-2011 at 4:54 pm

A three-dimensional integrated circuit (3D IC ) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor industry is hotly pursuing this emerging technology in many different forms, as a result the full definition is still somewhat… Read More