Generative AI is dramatically changing the compute power that must be delivered by advanced designs. This demand has risen by more than 10,000 times in the past five to six years. This increased demand has impacted the entire SoC design flow. We are now faced with going beyond 1 trillion transistors per chip, and systems now consist… Read More
Tag: 3D stacking
Update on TSMC’s 3D Fabric Technology
TSMC recently held their 10th annual Open Innovation Platform (OIP) Ecosystem Forum. An earlier article summarized the highlights of the keynote presentation from L.C. Lu, TSMC Fellow and Vice-President, Design and Technology Platform, entitled “TSMC and Its Ecosystem for Innovation” (link).
Overview of 3D Fabric
The TSMC… Read More