The overwhelming majority of transistors produced in the world are used in memory cells, either as the memory itself (Flash, SRAM), or as the access device (DRAM). Yet, it is not necessary to have a transistor in every memory cell. In 2015, 3D XPoint, the first major product based on transistor-less memory cells, was announced [1].
Tag: 3d memory
TSV Modeling Key for Next Generation SOC Module Performance
The use of silicon interposers is growing. Several years ago Xilinx broke new ground by employing interposers in their Virtex®-7 H580T FPGA. Last August Samsung announced what they say is the first DDR4 module to use 3D TSV’s for enterprise servers. Their 64GB double data rate-4 modules will be used for high end computing where … Read More