Thermal and Stress Analysis of 3D-ICs with Celsius Thermal Solver

Thermal and Stress Analysis of 3D-ICs with Celsius Thermal Solver
by Admin on 06-01-2021 at 12:00 am

Overview

Join us to fully understand the thermal and stress challenges introduced by 3D-ICs, which are cross-fabric problems.  Learn how the Cadence Celsius™ Thermal Solver helps you solve this problem by producing thermal gradient for the whole system, enabling analysis from early design to signoff​.

Takeaways:

  • Seamless
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Webinar: Electrothermal Signoff for 2.5D and 3D IC Systems

Webinar: Electrothermal Signoff for 2.5D and 3D IC Systems
by Mike Gianfagna on 02-08-2021 at 6:00 am

Webinar Electrothermal Signoff for 2.5D and 3D IC Systems

The move from single-chip design to system-in-package design has created many challenges. The rise of 2.5D and 3D technology has set the stage for this. Beyond the modeling requirements and the need for ecosystem collaboration to get those models, there is a significant challenge in understanding the data. The only way to truly… Read More


3D Standards

3D Standards
by Paul McLellan on 02-01-2012 at 5:06 pm

At DesignCon this week there was a panel on 3D standards organized by Si2. I also talked to Aveek Sarkar of Apache (a subsidiary of Ansys) who is one of the founding member companies of the Si2 Open3D Technical Advisory Board (TAB), along with Atrenta, Cadence, Fraunhofer Institute, Global Foundries, Intel, Invarian, Mentor, Qualcomm,… Read More