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The move from single-chip design to system-in-package design has created many challenges. The rise of 2.5D and 3D technology has set the stage for this. Beyond the modeling requirements and the need for ecosystem collaboration to get those models, there is a significant challenge in understanding the data. The only way to truly… Read More
3D Standardsby Paul McLellan on 02-01-2012 at 5:06 pmCategories: Ansys, Inc., EDA
At DesignCon this week there was a panel on 3D standards organized by Si2. I also talked to Aveek Sarkar of Apache (a subsidiary of Ansys) who is one of the founding member companies of the Si2 Open3D Technical Advisory Board (TAB), along with Atrenta, Cadence, Fraunhofer Institute, Global Foundries, Intel, Invarian, Mentor, Qualcomm,… Read More
