Breaking out of the ivory tower: 3D IC thermal analysis for all

Breaking out of the ivory tower: 3D IC thermal analysis for all
by Admin on 08-26-2025 at 6:00 am

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Todd Burkholder and Andras Vass-Varnai, Siemens EDA

As semiconductor devices become smaller, more powerful and more densely integrated, thermal management has shifted from an afterthought to a central challenge in modern IC design. In contemporary 3D IC architectures—where multiple chiplets are stacked and closely arrayed—power… Read More


CoPoS is a Bigger Canvas for Chiplets and HBM

CoPoS is a Bigger Canvas for Chiplets and HBM
by Admin on 08-03-2025 at 10:00 am

Chip on Panel on Substrate, often shortened to CoPoS, extends the familiar idea of chip on carrier packaging by moving the redistribution and interposer style structures from circular wafers to large rectangular panels. The finished panel assembly is then mounted on an organic or glass package substrate. This shift from round

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CEO Interview with Bob Fung of Owens Design

CEO Interview with Bob Fung of Owens Design
by Daniel Nenni on 08-01-2025 at 10:00 am

Bob Fung Photo

Bob Fung is the CEO of Owens Design, a Silicon Valley company specializing in the design and build of complex equipment that powers high-tech manufacturing. Over his 22-year tenure, Bob has led the development of more than 200 custom systems for world-class companies across the semiconductor, biomedical, energy, and emerging… Read More


Enabling the Ecosystem for True Heterogeneous 3D IC Designs

Enabling the Ecosystem for True Heterogeneous 3D IC Designs
by Kalar Rajendiran on 07-28-2025 at 10:00 am

The Shift to System Technology Co Optimization

The demand for higher performance, greater configurability, and more cost-effective solutions is pushing the industry toward heterogeneous integration and 3D integrated circuits (3D ICs). These solutions are no longer reserved for niche applications—they are rapidly becoming essential to mainstream semiconductor design.… Read More


Altair SimLab: Tackling 3D IC Multiphysics Challenges for Scalable ECAD Modeling

Altair SimLab: Tackling 3D IC Multiphysics Challenges for Scalable ECAD Modeling
by Kalar Rajendiran on 07-10-2025 at 10:00 am

What is SimLab

The semiconductor industry is rapidly moving beyond traditional 2D packaging, embracing technologies such as 3D integrated circuits (3D ICs) and 2.5D advanced packaging. These approaches combine heterogeneous chiplets, silicon interposers, and complex multi-layer routing to achieve higher performance and integration.… Read More


Siemens EDA Unveils Groundbreaking Tools to Simplify 3D IC Design and Analysis

Siemens EDA Unveils Groundbreaking Tools to Simplify 3D IC Design and Analysis
by Kalar Rajendiran on 07-01-2025 at 10:00 am

Innovator3D IC Solution Suite

In a major announcement at the 2025 Design Automation Conference (DAC), Siemens EDA introduced a significant expansion to its electronic design automation (EDA) portfolio, aimed at transforming how engineers design, validate, and manage the complexity of next-generation three-dimensional integrated circuits (3D ICs).… Read More


Altair at the 2025 Design Automation Conference #62DAC

Altair at the 2025 Design Automation Conference #62DAC
by Daniel Nenni on 06-17-2025 at 8:00 am

62nd DAC SemiWiki

Design Perfection from Concept to Tape-out Booth #1617 at DAC25 – June 23-25, 2025

Join us to learn how Altair’s world-class solutions are powering perfect semiconductor design.

The semiconductor industry operates at an accelerated pace, in which every second saved is a competitive advantage. You must rely on solutions

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Siemens EDA Outlines Strategic Direction for an AI-Powered, Software-Defined, Silicon-Enabled Future

Siemens EDA Outlines Strategic Direction for an AI-Powered, Software-Defined, Silicon-Enabled Future
by Kalar Rajendiran on 06-09-2025 at 6:00 am

Software defined Systems of Systems

In a keynote delivered at this year’s Siemens EDA User2User event, CEO Mike Ellow presented a focused vision for the evolving role of electronic design automation (EDA) within the broader context of global technology shifts. The session covered Siemens EDA’s current trajectory, market strategy, and the changing landscape … Read More


Video EP3: A Discussion of Challenges and Strategies for Heterogeneous 3D Integration with Anna Fontanelli

Video EP3: A Discussion of Challenges and Strategies for Heterogeneous 3D Integration with Anna Fontanelli
by Daniel Nenni on 05-02-2025 at 10:00 am

In this episode of the Semiconductor Insiders video series, Dan is joined by Anna Fontanelli, founder and CEO of MZ Technologies. Anna explains some of the substantial challenges associated with heterogeneous 3D integration. Dan then begins to explore some of the capabilities of GenioEVO, the first integrated chiplet/package… Read More


Automotive Functional Safety (FuSa) Challenges

Automotive Functional Safety (FuSa) Challenges
by Daniel Payne on 04-29-2025 at 10:00 am

silicon lifecycle management slm diagram min

Modern vehicles have become quite sophisticated, like a supercomputer on wheels. They integrate a vast number of electronic components, including thousands of chips, to deliver advanced functionalities ranging from infotainment to critical safety systems. This increasing complexity necessitates a robust approach to … Read More