Seminar: 2.5D/3D IC Packaging Verification

Seminar: 2.5D/3D IC Packaging Verification
by Daniel Payne on 11-06-2019 at 10:00 am

Mentor - A Siemens Business

Overview

Do you want to find out, hands-on, how many of the leading fabless semiconductor companies are verifying their complex 2.5/3D heterogeneous and homogeneous package assemblies?  Here is your chance to meet our technical staff and ask your questions.  Come and see why fabless semiconductor companies are adopting this… Read More


eSilicon White Paper on Chiplets – Good Read

eSilicon White Paper on Chiplets – Good Read
by Randy Smith on 10-17-2019 at 10:00 am

eSilicon recently released a paper detailing its experiences and its thoughts on the future of chiplets. The author of the white paper is Dr. Carlos Macián. I have also covered a presentation given by Carlos recently at the AI Hardware Summit, and he is well-spoken and quite knowledgeable. To get the white paper, go to the eSiliconRead More