MediaTek Dimensity 9500 Unleashes Best-in-Class Performance, AI Experiences, and Power Efficiency for the Next Generation of Mobile Devices

In a bold move to dominate the premium mobile chipset market, MediaTek unveiled the Dimensity 9500 on September 22, 2025, from Shenzhen, China. This flagship SoC promises to elevate 5G smartphones with unparalleled performance, on-device AI capabilities, and energy efficiency, positioning MediaTek as the undisputed leader in gaming, compute, imaging, and artificial intelligence. As the world’s top supplier of smartphone SoCs, MediaTek’s latest innovation arrives at a pivotal moment when consumers demand devices that are not just powerful but intelligently adaptive to daily life.

Manufactured using the TSMC N3P (enhanced performance) process, the heart of the Dimensity 9500 lies a third-generation All Big Core CPU architecture, featuring a blazing-fast 4.21GHz ultra core, three premium cores, and four performance cores. Paired with four-lane UFS 4.1 storage, it delivers a staggering 32% uplift in single-core performance and 17% in multi-core tasks over its predecessor. Yet, the real magic is in efficiency: the ultra core slashes power consumption by up to 55% at peak loads, ensuring longer battery life without compromising speed.

“As AI becomes part of everyday life, consumers want devices that feel smarter, faster, and more personal without sacrificing battery life,” said JC Hsu, corporate senior vice president at MediaTek and general manager of the Wireless Communications Business Unit. “The MediaTek Dimensity 9500 delivers exactly that: Breakthrough on-device AI, top-tier performance and efficiency, and a full suite of premium experiences that our partners can bring to users around the world.”

Enhancing this prowess is a revamped cache and memory system, including the industry’s first 4-channel UFS 4.1 support. This doubles read/write speeds and accelerates large AI model loading by 40%, while the second-generation Dimensity scheduler ensures seamless responsiveness under heavy multitasking. Gamers will rejoice with the integration of the Arm G1-Ultra GPU, boasting 33% higher peak performance and 42% better power efficiency. It introduces double frame rate interpolation up to 120FPS, enabling console-level ray tracing. Through collaborations with top studios, the chipset supports MegaLights in Unreal Engine 5.6 and Nanite in Unreal Engine 5.5, unlocking AAA real-time rendering and immersive lighting for mobile titles.

AI takes center stage with the ninth-generation MediaTek NPU 990, powered by Generative AI Engine 2.0. This doubles compute power and pioneers BitNet 1.58-bit large model processing, cutting energy use by 25%. The ultra-efficient NPU small models with over 56% less power draw, facilitating 100% faster output from 3-billion-parameter LLMs, 128K token long-text processing, and the world’s first 4K ultra-high-definition image generation. The result? A truly “agentic” AI user experience—proactive, personalized, collaborative, evolving, and secure—that anticipates user needs in real time.

The Dimensity 9500 is the first to support an integrated compute-in-memory architecture for its newly-added Super Efficient NPU, significantly reducing power consumption and enabling AI models to run continuously. This advancement further enhances end-user experiences with more sophisticated proactive AI.

Imaging enthusiasts aren’t left behind. The Imagiq 1190 ISP handles RAW-domain pre-processing, up to 200MP capture, 30fps continuous focus tracking and new portrait engine, while supporting cinematic 4K 60FPS portrait videos. It offers offers the latest MiraVision Adaptive Display technology, which dynamically adjusts contrast and color saturation based on ambient lighting, panel characteristics, and real-time content analysis. This ensures a clear viewing experience both outdoors in high-brightness scenarios — without overheating during prolonged use — and indoors in extremely dark environments, providing eye protection while maintaining clarity.”

Connectivity shines too, with MiraVision for adaptive displays, Bluetooth calls, Wi-Fi fast transfer, and multi-network intelligence for uninterrupted 5G/Wi-Fi handoffs. AI-driven communication tech reduces 5G power by 10% and Wi-Fi by 20%, with 5CC carrier aggregation boosting bandwidth 15%. Plus, AI positioning and network selection yield 20% higher accuracy and 50% lower latency than rivals.

MediaTek’s Dimensity 9500 stems from years of R&D and ecosystem partnerships with game studios, OEMs, and software giants. Flagship devices powered by this chipset are slated for Q4 2025 launches, promising to flood the market with smarter, greener flagships. For more on MediaTek’s 5G lineup, visit i.mediatek.com/mediatek-5g.

Press release URL

Also Read:

MediaTek Develops Chip Utilizing TSMC’s 2nm Process, Achieving Milestones in Performance and Power Efficiency

TSMC’s 2024 Sustainability Report: Pioneering a Greener Semiconductor Future

TSMC 2025 Update: Riding the AI Wave Amid Global Expansion