Something New in Analog Test Automation

Something New in Analog Test Automation
by Daniel Payne on 09-16-2025 at 10:00 am

IJTAG min

Digital design engineers have used DFT automation technologies like scan and ATPG for decades now, however, analog blocks embedded within SoCs have historically required that a test engineer write tests that require specialized expertise and that can take man-months to debug. Siemens has a long history in the DFT field, SPICE… Read More


Exploring Cycuity’s Radix-ST: Revolutionizing Semiconductor Security

Exploring Cycuity’s Radix-ST: Revolutionizing Semiconductor Security
by Daniel Nenni on 09-09-2025 at 6:00 am

image


Cycuity’s Radix-ST represents a groundbreaking advancement in semiconductor security, addressing the growing complexity and vulnerability of modern chip designs. Introduced on August 27, 2025, by Cycuity, Inc., Radix-ST leverages static analysis techniques to identify and resolve security weaknesses early in the chip… Read More


RANiX Employs CAST’s TSN IP Core in Revolutionary Automotive Antenna System

RANiX Employs CAST’s TSN IP Core in Revolutionary Automotive Antenna System
by Daniel Nenni on 09-06-2025 at 8:00 am

ranix TSN SW antenna array figure

This press release from CAST announces a significant collaboration with RANiX Inc., highlighting the integration of CAST’s TSN Switch IP core into RANiX’s new Integrated Micro Flat Antenna System (IMFAS) SoC. This development underscores the growing adoption of Time-Sensitive Networking (TSN) in the automotive… Read More


The Critical Role of Pre-Silicon Security Verification with Secure-IC’s Laboryzr™ Platform

The Critical Role of Pre-Silicon Security Verification with Secure-IC’s Laboryzr™ Platform
by Kalar Rajendiran on 08-11-2025 at 10:00 am

Pre Silicon Security Verification (Hardware SCA)

As embedded systems and System-on-Chip (SoC) designs grow in complexity and integration, the risk of physical attacks has dramatically increased. Modern day adversaries no longer rely solely on software vulnerabilities; instead, they exploit the physical properties of silicon to gain access to sensitive data. Side-channel… Read More


The Future of Mobility: Insights from Steve Greenfield

The Future of Mobility: Insights from Steve Greenfield
by Admin on 08-02-2025 at 8:00 am

DAC 62 Systems on Chips

On July 18, 2025, Steve Greenfield, an early-stage investor and author, delivered a compelling 45-minute talk at DACtv on the future of mobility. Quoting futurist William Gibson—“The future is already here. It’s just not evenly distributed”—Greenfield explored how emerging technologies and business models are reshaping… Read More


Modern Data Management: Overcoming Bottlenecks in Semiconductor Engineering

Modern Data Management: Overcoming Bottlenecks in Semiconductor Engineering
by Admin on 08-01-2025 at 10:00 am

DAC 62 Systems on Chips

In a DACtv session on July 9, 2025, Pedro Pires from Keysight’s Design Engineering Software addressed the critical role of data management in modern semiconductor engineering projects. The presentation highlighted why data has become a bottleneck, how Keysight’s SOS (Save Our Source) platform mitigates these challenges,… Read More


Security Coverage: Assuring Comprehensive Security in Hardware Design

Security Coverage: Assuring Comprehensive Security in Hardware Design
by Daniel Nenni on 07-24-2025 at 10:00 am

Assuring Comprehensive Security in Hardware Design

As hardware systems become increasingly complex and security threats grow more sophisticated, ensuring robust hardware security during the pre-silicon phase of development is more critical than ever. Cycuity’s white paper outlines how its Radix platform enables engineers to verify, visualize, and measure the effectiveness… Read More


Memory Innovation at the Edge: Power Efficiency Meets Green Manufacturing

Memory Innovation at the Edge: Power Efficiency Meets Green Manufacturing
by Admin on 07-22-2025 at 10:00 am

Figure 1

By Tetsu Ho

With the ever-increasing global demand for smarter, faster electronic systems, the semiconductor industry faces a dual challenge: delivering high-performance memory while reducing environmental impact. Winbond is meeting this challenge head-on by embedding sustainability into every layer of its operations—from… Read More


New Cooling Strategies for Future Computing

New Cooling Strategies for Future Computing
by Daniel Payne on 07-17-2025 at 10:00 am

thermal panel dac min

Power densities on chips increased from 50-100 W/cm2 in 2010 to 200 W/cm2 in 2020, creating a significant challenge in removing and spreading heat to ensure reliable chip operation. The DAC 2025 panel discussion on new cooling strategies for future computing featured experts from NVIDIA Research, Cadence, ESL/EPFL, the University… Read More


Arteris at the 2025 Design Automation Conference #62DAC

Arteris at the 2025 Design Automation Conference #62DAC
by Daniel Nenni on 06-22-2025 at 8:00 am

62nd DAC SemiWiki

Key Takeaways:

  • Expanded Multi-Die Solution: Arteris showcases its foundational technology for rapid chiplet-based innovation. Check out the multi-die highlights video.
  • Ecosystem compatibility: Supported through integration with products from major EDA and foundry partners, including Cadence, Synopsys, and global
Read More