Video EP4: A Deeper Look at Advanced Packaging & Multi-Die Design Challenges with Anna Fontanelli
In this episode of the Semiconductor Insiders video series, Dan is once again joined by Anna Fontanelli, founder and CEO of MZ Technologies. In this discussion, more details of the challenges presented by advanced packaging and multi-die design are explored. Anna provides details of what’s involved in architectural exploration and interconnect management. She also provides some background on how MZ Technologies helps tame these challenges with its GENIO EVO platform.
The views, thoughts, and opinions expressed in these videos belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual.
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