Podcast EP315: The Journey to Multi-Die and Chiplet Design with Robert Kruger of Synopsys
Daniel is joined by Robert Kruger, product management director at Synopsys, where he oversees IP solutions for multi-die designs, including 2D, 3D, and 3.5D topologies. Throughout his career, Robert has held key roles in product marketing, business development, and roadmap planning at leading companies such as Intel, Broadcom, Nokia, and Altera. He brings extensive expertise in semiconductor technologies, including ASICs and FPGA products, as well as deep knowledge of specialized requirements across various sectors, including wireless infrastructure, military, automotive, industrial, and data center markets.
Dan explores emerging multi-die/chiplet design with Robert, who covers a wide range of topics. Robert discusses the market drivers for chiplets, both from a captive and open market perspective. He explains how markets will mature based on both business and technical needs. Roberts describes what the journey to a chiplet-based multi-die design approach looks like.
He discusses the value of IP subsystems and how they are built. Robert also covers the design and verification challenges associated with this new design approach and concludes with a summary of the capabilities Synopsys brings to the market to enable multi-die and chiplet-based solutions.
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