Podcast EP300: Next Generation Metalization Innovations with Lam’s Kaihan Ashtiani
Dan is joined by Kaihan Ashtiani, Corporate Vice President and General Manager of atomic layer deposition and chemical vapor deposition metals in Lam’s Deposition Business Unit. Kaihan has more than 30 years of experience in technical and management roles, working on a variety of semiconductor tools and processes.
Dan explores the challenges of metallization for advanced semiconductor devices with Kaihan, where billions of connections must be patterned reliably to counteract heat and signal integrity problems. Kaihan describes the move from chemical vapor deposition to the atomic layer deposition approach used for advanced nodes. He also discusses the motivations for the move from tungsten to molybdenum for metalization.
He explains that thin film resistivity challenges make molybdenum a superior choice, but working with this material requires process innovations that Lam has been leading. Kaihan describes the ALTUS Halo tool developed by Lam and the ways this technology addresses the challenges of metallization patterning for molybdenum, both in terms of quality of results and speed of processing.
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