Podcast EP230: An Overview of the Siemens EDA Calibre 3D Thermal Announcement at DAC with Dr. John Ferguson

Podcast EP230: An Overview of the Siemens EDA Calibre 3D Thermal Announcement at DAC with Dr. John Ferguson
by Daniel Nenni on 06-25-2024 at 8:00 am

Dan is joined by Dr. John Ferguson, senior director of marketing for the Calibre product line at Siemens EDA. John has worked extensively in physical design verification. Current activities include efforts to extend physical verification and PDK enablement for 3DIC design and silicon photonics.

Dan explores the Siemens EDA Calibre 3D Thermal announcement with John that was made during the conference.

John describes the significant new challenges that 3DIC design presents with regard to thermal analysis and modeling. He explains the unique approach that the new Calibre 3D Thermal takes and how it can be used to optimize many different types of designs.

He explores how to use the tool in a Siemens EDA design flow and how to interface the tool to other design flows as well.

The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual.

Podcast thumbnail
Semiconductor Insiders
Podcast EP230: An Overview of the Siemens EDA Calibre 3D Thermal Announcement at DAC with Dr. John Ferguson
Loading
/
Share this post via:

Comments

There are no comments yet.

You must register or log in to view/post comments.