VSORA, a pioneering high-tech company, has engineered a novel architecture designed specifically to meet the stringent demands of AI inference—both in datacenters and at the edge. With near-theoretical performance in latency, throughput, and energy efficiency, VSORA’s architecture breaks away from legacy designs optimized… Read More
WEBINAR: Is Agentic AI the Future of EDA?The semiconductor industry is entering a transformative era,…Read More
FPGA Prototyping in Practice: Addressing Peripheral Connectivity ChallengesModern chip design verification often encounters challenges when…Read More
An Insight into Building Quantum ComputersGiven my physics background I’m ashamed to admit…Read More
I Have Seen the Future with ChipAgents Autonomous Root Cause AnalysisI have seen a lot of EDA tool…Read MoreAI-Driven DRC Productivity Optimization: Revolutionizing Semiconductor Design
The semiconductor industry is undergoing a transformative shift with the integration of AI into DRC workflows, as showcased in the Siemens EDA presentation at the 2025 TSMC OIP. Titled “AI-Driven DRC Productivity Optimization,” this initiative, led by Siemens EDA’s David Abercrombie alongside AMD’s… Read More
Emulator-Like Simulation Acceleration on GPUs. Innovation in Verification
GPUs have been proposed before to accelerate logic simulation but haven’t quite met the need yet. This is a new attempt based on emulating emulator flows. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and lecturer at Stanford, EE292A) and I continue our series… Read More
CEO Interview with Wilfred Gomes of Mueon Corporation
Wilfred Gomes is the co-founder, CEO, and president of Mueon Corporation, a next-generation infrastructure startup rethinking how data centers are built for the AI era. The company’s flagship innovation, Cubelets™, modular, stackable units that unite compute, memory, power delivery and thermal management, replace the … Read More
Pioneering Edge AI: TekStart’s Cognitum Processor Ushers in a New Era of Efficient Intelligence
One of the more in interesting companies I met at the AI Infra Summit was a company known to me for some time. The most interesting part was the chip they are in the process of taping out; It is a high-performance, ultra-low-power AI processor purpose-built for edge computing. It is claimed to deliver “the processing muscle … Read More
CAST Simplifies RISC-V Embedded Processor IP Adoption with New Catalyst Program
In a move poised to accelerate the integration of open-source processor architectures into resource-constrained devices, semiconductor IP provider CAST, Inc. unveiled its Catalyst™ Program at the RISC-V Summit in Santa Clara, California. This initiative addresses a persistent pain point for embedded system developers:… Read More
Podcast EP313: How proteanTecs Optimizes Production Test
Daniel is joined by Alex Burlak is Vice President of Test & Analytics at proteanTecs. With combined expertise in production testing and data analytics of ICs and system products, Alex joined proteanTecs in October, 2018. Before joining the company, Alex held a Senior Director of Interconnect and Silicon Photonics Product… Read More
CEO Interview with Alex Demkov of La Luce Cristallina
Alex Demkov is co-founder and CEO of La Luce Cristallina. He is a distinguished figure in the field of materials physics, serving as a Professor at the University of Texas at Austin. With a prolific career marked by notable achievements, Alex boasts an impressive portfolio of 10 U.S. patents and many patent applications, showcasing… Read More
IPLM Today and Tomorrow from Perforce
Today, Perforce IPLM stands at the intersection of data management, automation, and collaboration, shaping the way companies design the next generation of chips and systems. Looking ahead, its evolution will reflect the growing convergence of hardware, software, and AI-driven engineering.
Chiplets: Powering the Next Generation of AI Systems
AI’s rapid expansion is reshaping semiconductor design. The compute and I/O needs of modern AI workloads have outgrown what traditional SoC scaling can deliver. As monolithic dies approach reticle limits, yields drop and costs rise, while analog and I/O circuits gain little from moving to advanced process nodes. To sustain … Read More


TSMC Formally Sues Ex-SVP Over Alleged Transfer of Trade Secrets to Intel