Artificial intelligence (AI) is transforming every layer of computing, from hyperscale data centers training trillion-parameter models to battery-powered edge devices performing real-time inference. Hardware requirements are escalating on every front: compute density is increasing, power budgets are tightening, … Read More
U.S. Electronics Production GrowingU.S. electronics production has been on an accelerating…Read More
Inference Acceleration from the Ground UpVSORA, a pioneering high-tech company, has engineered a…Read More
AI-Driven DRC Productivity Optimization: Revolutionizing Semiconductor DesignThe semiconductor industry is undergoing a transformative shift…Read More
Emulator-Like Simulation Acceleration on GPUs. Innovation in VerificationGPUs have been proposed before to accelerate logic…Read More
Pioneering Edge AI: TekStart's Cognitum Processor Ushers in a New Era of Efficient IntelligenceOne of the more in interesting companies I…Read MoreThe RISC-V Revolution: Insights from the 2025 Summits and Andes Technology’s Pivotal Role
RISC-V has emerged as a cornerstone of modern computing, offering an open-source alternative to proprietary designs like ARM and x86. Free from licensing fees and highly extensible, RISC-V powers everything from IoT devices to AI accelerators, with over 13 billion cores shipped globally. Annual RISC-V Summits, organized… Read More
GlobalFoundries, MIPS, and the Chiplet Race for AI Datacenters
GlobalFoundries’ (GF) acquisition of MIPS in 2025 wasn’t a nostalgic move to revive a legacy CPU brand. It was a calculated step into one of the most lucrative frontiers in semiconductors: AI, high-performance computing (HPC), and datacenters. As Nvidia, AMD, Intel, and hyperscalers embrace chiplet architectures, GF is betting… Read More
Moores Lab(AI): Agentic AI and the New Era of Semiconductor Design
For decades, chip design has been a delicate balance of creativity and drudgery. Architects craft detailed specifications, engineers read those documents line by line, and teams write and debug thousands of lines of Verilog and UVM code. Verification alone can consume up to 35 percent of a project’s cost and add many months to … Read More
Breaking the Thermal Wall: TSMC Demonstrates Direct-to-Silicon Liquid Cooling on CoWoS®
In a landmark presentation at the 2025 IEEE Electronic Components and Technology Conference (ECTC), TSMC unveiled a groundbreaking advancement in thermal management: Direct-to-Silicon Liquid Cooling integrated directly onto its CoWoS® platform. This innovation, detailed in the paper “Direct-to-Silicon Liquid… Read More
From Prompts to Prompt Engineering to Knowing Ourselves
I am on a voyage of discovery through prompting and prompting technologies because these are the critical interfaces between what we want (or roughly imagine we want) from AI, and AI’s ability to deliver. I have seen suggestions that any deficiencies today are a detail that will soon be overcome. I’m not so sure. Yes, prompting technology… Read More
GaN Device Design and Optimization with TCAD
I’ve read articles about power electronics, RF systems and high-frequency applications using SiC and GaN transistors, especially in EVs and chargers, but hadn’t looked into the details of GaN devices. A recent Silvaco webinar proved to be just the format that I needed to learn more about GaN design and optimization. Udita Mittal,… Read More
How the Father of FinFETs Helped Save Moore’s Law
In the early 2000s, Moore’s Law—the observation that the number of transistors on a chip doubles roughly every two years—was facing an existential crisis. As semiconductor nodes shrank below 90nm, planar transistors suffered from debilitating issues: leakage currents soared, power efficiency plummeted, and scaling became… Read More
A Remote Touchscreen-like Control Experience for TVs and More
How do you control your smart TV? With a remote control of course, already quite capable since it allows voice commands to find a movie or TV show without needing all that fiddly button-based control and lookup. But there’s a range of things you can’t do that we take for granted on a tablet or phone screen. Point and click on an object,… Read More
Teradyne and TSMC: Pioneering the Future of Semiconductor Testing Through the 2025 OIP Partner of the Year Award
In a significant milestone for the semiconductor industry, Teradyne was honored as the 2025 TSMC Open Innovation Platform® Partner of the Year for TSMC 3DFabric® Testing. This award, announced on September 25, 2025, underscores the deep collaboration between Teradyne, a leader in automated test equipment and robotics, and… Read More


Intel to Compete with Broadcom and Marvell in the Lucrative ASIC Business