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Semiconductor Expert Forum

Podcast EP241: A Look at Agile Analog IP with Chris Morrison

Podcast EP241: A Look at Agile Analog IP with Chris Morrison
by Daniel Nenni on 08-16-2024 at 10:00 am
Categories: Agile Analog, IP

Dan is joined by Chris Morrison, who has over 15 years of experience in delivering innovative analog, digital, power management and audio solutions for International electronics companies, and developing strong relationships with key partners across the semiconductor industry. Currently he is the Director of Product Marketing… Read More

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CEO Interview: Anders Storm of Sivers Semiconductors

CEO Interview: Anders Storm of Sivers Semiconductors
by Daniel Nenni on 08-16-2024 at 6:00 am
Categories: CEO Interviews

Anders Storm Sivers

Anders Storm is the CEO of Sivers Semiconductors. Under his almost decade-long leadership, the company has experienced significant growth, solidifying its position as a key player in the global semiconductor industry. With expertise in wifi communications, 5G, and photonics, he drives the company’s corporate strategy, … Read More

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Emerging Memories Overview

Emerging Memories Overview
by Daniel Nenni on 08-15-2024 at 10:00 am
Categories: Events, IP, Weebit Nano
1 Comment

ReRAM History 2024

This year’s Future of Memory and Storage Conference (formerly the Flash Memory Summit) was again very well attended. The Santa Clara Convention Center is definitely the place to be for a Silicon Valley Conference.

This post is about the Emerging Memories session organized by Dave Eggleston. We will be covering other sessions… Read More

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The Impact of UCIe on Chiplet Design: Lowering Barriers and Driving Innovation

The Impact of UCIe on Chiplet Design: Lowering Barriers and Driving Innovation
by Kalar Rajendiran on 08-15-2024 at 6:00 am
Categories: AI, Cadence, Chiplet, EDA, IP

Comparative Analysis of Chiplet Interconnect Standards (Physical Layer)

The semiconductor industry is experiencing a significant transformation with the advent of chiplet design, a modular approach that breaks down complex chips into smaller, functional blocks called chiplets. A chiplet-based design approach offers numerous advantages, such as improved performance, reduced development … Read More

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CEO Interview: Zeev Collin of Semitech Semiconductor

CEO Interview: Zeev Collin of Semitech Semiconductor
by Daniel Nenni on 08-14-2024 at 10:00 am
Categories: CEO Interviews

Zeev 29

Zeev Collin is a seasoned technology executive and serial entrepreneur with over 25 years of experience in executive management across international semiconductor companies and startups. Prior to co-founding Semitech, Zeev co-founded and successfully exited two ventures focused on vehicle and trailer tracking devices.… Read More

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WEBINAR: Silicon Area Matters!

WEBINAR: Silicon Area Matters!
by Daniel Nenni on 08-14-2024 at 8:00 am
Categories: eFPGA, Events, Flex Logix

SemiWiki Flex Logix Webinar

When designing IP for system-on-chip (SoC) and application-specific integrated circuit (ASIC) implementations, IP designers strive for perfection. Optimal engineering often yields the smallest die area, thereby reducing both cost and power consumption while maximizing performance.

Similarly, when incorporating embedded… Read More

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First third-party ISO/SAE 21434-certified IP product for automotive cybersecurity

First third-party ISO/SAE 21434-certified IP product for automotive cybersecurity
by Don Dingee on 08-14-2024 at 6:00 am
Categories: IP, Synopsys

ISO/SAE 21434 and UNECE WP.29 R155

Increased processing and connectivity in automobiles are cranking up the priority for advanced cybersecurity steps to keep roads safe. Electronic vehicle interfaces, including 5G/6G, Bluetooth, Wi-Fi, GPS, USB, CAN, and others, offer convenience features for drivers and passengers, but open numerous attack vectors for… Read More

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Circuit Simulation Update from Empyrean at #61DAC

Circuit Simulation Update from Empyrean at #61DAC
by Daniel Payne on 08-13-2024 at 10:00 am
Categories: EDA, Empyrean

Empyrean SPICE min

A familiar face in EDA, Greg Lebsack met with me in the Empyrean booth at DAC this year on opening day to provide an update on what’s new. I first met Greg when he was at Tanner EDA, then Mentor and Siemens EDA, so he really knows our industry quite well. The company was a Silver level sponsor of DAC this year, and Empyrean offers tools for… Read More

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Why Glass Substrates?

Why Glass Substrates?
by Sharada Yeluri on 08-13-2024 at 6:00 am
Categories: 3D IC
1 Comment

Intel Glass Substrates

The demand for high-performance and sustainable computing and networking silicon for AI has undoubtedly increased R&D dollars and the pace of innovation in semiconductor technology. With Moore’s Law slowing down at the chip level, there is a desire to pack as many chiplets as possible inside ASIC packages and get … Read More

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PieceMakers HBLL RAM: The Future of AI DRAM

PieceMakers HBLL RAM: The Future of AI DRAM
by Joe Ting on 08-12-2024 at 6:00 am
Categories: IP, RISC-V

PieceMaker Memory

PieceMakers, a fabless DRAM product company, is making waves in the AI industry with the introduction of a new DRAM family that promises to outperform traditional High Bandwidth Memory (HBM). The launch event featured industry experts, including a representative from Samsung, highlighting the significance of this innovation.… Read More