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Thick Data vs. Big Data

Thick Data vs. Big Data
by Ahmed Banafa on 11-07-2021 at 10:00 am

Thick Data vs. Big Data

One of the challenges facing businesses in post-COVID-19 world is the fact that consumer behavior won’t go back to pre-pandemic norms. Consumers will purchase more goods and services online, and increasing numbers of people will work remotely just to mention few major changes . As companies begin to navigate the post-COVID-19… Read More


GM’s Postcard from Fantasyland

GM’s Postcard from Fantasyland
by Roger C. Lanctot on 11-07-2021 at 6:00 am

GMs Postcard from Fantasyland

In the midst of what may well be the greatest electric vehicle debacle of the nascent EV era, General Motors put on a happy face telling investors two weeks ago that all things EV and autonomous were going swimmingly to plan with gumdrops and sugar plums coming on the road ahead. GM claimed before-end-of-year availability for the… Read More


Podcast EP46: Arteris IP – the role and impact of system IP

Podcast EP46: Arteris IP – the role and impact of system IP
by Daniel Nenni on 11-05-2021 at 10:00 am

Dan is joined by industry veteran Charlie Janac, chairman, president and CEO of Arteris IP. Dan explores the various products that comprise system IP with Charlie, including the high growth markets he sees. Dan and Charlie also have an interesting discussion about autonomous driving – when and how it will likely be deployed… Read More


CEO Update: Tuomas Hollman, Minima Processor CEO

CEO Update: Tuomas Hollman, Minima Processor CEO
by Daniel Nenni on 11-05-2021 at 6:00 am

Tuomas Hollman Minima CEO 2

Tuomas Hollman is an experienced senior executive, with proficiency that ranges from strategy to product development and business management. He began his semiconductor industry career at Texas Instruments, serving for 15 years in increasingly important roles, including general management and profit and loss responsibility… Read More


Cliosoft Webinar: What’s Needed for Next Generation IP-Based Digital Design

Cliosoft Webinar: What’s Needed for Next Generation IP-Based Digital Design
by Mike Gianfagna on 11-04-2021 at 10:00 am

Cliosoft Webinar Whats Needed for Next Generation IP Based Digital Design

There’s plenty of talk about requirements for IP data management. The fundamental methods to prevent chaos, waste or worse are popular topics. I’ve covered webinars from Cliosoft on the topic on SemiWiki. But what about the future? What’s really needed to set up a path that scales, addressing the challenges of today and the new … Read More


KLAC- Foundry/Logic Drives Outperformance- No Supply Chain Woes- Nice Beat

KLAC- Foundry/Logic Drives Outperformance- No Supply Chain Woes- Nice Beat
by Robert Maire on 11-04-2021 at 8:00 am

KLAC Tencor SemiWiki

KLA- great quarter driven by continued strong foundry/logic
No supply chain hiccups- Riding high in the cycle
Wafer inspection remains driver with rest along for the ride
Financials remain best in industry

A superb quarter
There was little to complain about in the quarter. Revenues of $2.1B and EPS of $4.64, both nicely beating… Read More


Five Reasons Why a High Performance Reconfigurable SmartNIC Demands a 2D NoC

Five Reasons Why a High Performance Reconfigurable SmartNIC Demands a 2D NoC
by Kalar Rajendiran on 11-04-2021 at 6:00 am

6 Reason 1 High Bandwidth 6

As part of their webinar series, SemiWiki hosted one in June with the title “Five Reasons Why a High Performance Reconfigurable SmartNIC Demands a 2D NoC.” The talk by given by Scott Schweitzer, Sr. Manager, Product Planning at Achronix. Scott is a lifelong technology evangelist and focuses on recognizing technology trends and… Read More


Alchip Reveals How to Extend Moore’s Law at TSMC OIP Ecosystem Forum

Alchip Reveals How to Extend Moore’s Law at TSMC OIP Ecosystem Forum
by Mike Gianfagna on 11-03-2021 at 10:00 am

Alchip Reveals How to Extend Moores Law at TSMC OIP Ecosystem Forum

The TSMC Open Innovation Platform (OIP) event brings together a wide array of companies reporting cutting edge work that are part of TSMC’s rather substantial ecosystem. The event covers everything from high-performance computing to mobile, automotive, IoT, RF and 3D IC design. Of particular interest for this post is a presentation… Read More


Update on TSMC’s 3D Fabric Technology

Update on TSMC’s 3D Fabric Technology
by Tom Dillinger on 11-03-2021 at 8:00 am

3D eTV testchip

TSMC recently held their 10th annual Open Innovation Platform (OIP) Ecosystem Forum.  An earlier article summarized the highlights of the keynote presentation from L.C. Lu, TSMC Fellow and Vice-President, Design and Technology Platform, entitled “TSMC and Its Ecosystem for Innovation” (link).

Overview of 3D Fabric

The TSMC… Read More


Back to Basics in RTL Design Quality

Back to Basics in RTL Design Quality
by Bernard Murphy on 11-03-2021 at 6:00 am

Deming min

Harry Foster waxes philosophical in a recent white paper from Siemens EDA, in this case on the origins of bugs and the best way to avoid them. Spoiler alert, the answer is not to make them in the first place or at least to flush them out very quickly. I’m not being cynical – that really is the answer though practice often falls short of ideal.… Read More