I enjoy talking with CEVA because they work on such interesting consumer products (among other product lines). My most recent discussion was with Seth Sternberg (Sensors and Audio software at CEVA), on spatial or 3D audio. The first steps to a somewhat immersive audio experience were stereo and surround sound, placing sound sources… Read More
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Nominations for Phil Kaufman Award, Phil Kaufman Hall of Fame Close June 30
Plan ahead now because Friday, June 30, is the deadline to submit nominations for the Phil Kaufman Award and the Phil Kaufman Hall of Fame for anyone you think is deserving of these honors. If you haven’t given it any thought, please consider nominating someone.
Before we look at both and the nomination requirements, here’s a thumbnail… Read More
Applied Materials Announces “EPIC” Development Center
On May 22nd Applied Materials announced a new development center, Equipment and Process Innovation and Commercialization Center (EPIC).
Applied Materials already operates the Maydan Technology Center (MTC), a billion-dollar development facility with over 120 advanced process tools and 80 metrology and inspection tools… Read More
PCI-SIG DevCon and Where Samtec Fits
PCIe (peripheral component interconnect express) is an interface standard for connecting high-speed components contained in PCs, MACs and other types of processors. Think graphics, storage arrays, Wi-Fi and the like. This communication standard has become incredibly popular. The first version of the standard was released… Read More
TSMC Clarified CAPEX and Revenue for 2023!
TSMC clarified CAPEX and revenue for 2023 last night at the Annual Shareholders Meeting. Last year TSMC guided up during this meeting but this year they guided down. CAPEX was guided down to the lower end of $36B-$32B. Revenue was guided down from low-single to mid-single digit so maybe down another percent or two. The TSMC Jan… Read More
Arm 2023 Mobile Solutions Continue Gaming Focus
Arm recently announced an update for mobile under the Arm Total Compute Solutions (TCS) label, led by Chris Bergey (Sr. VP/GM for the Client line of business). You’ll remember that Chris headed the infrastructure line of business impressively through the Neoverse brand, as demonstrated by Arm-based servers appearing in multiple… Read More
Automotive IP Certification
The electrification of cars and the growth of EVs means that more semiconductor content is being added with every new vehicle model from suppliers around the globe. There are unique concerns for automotive IP in terms of reliability, security and safety over the lifetime of the vehicle. I had the pleasure to speak with Pawini Mahajan… Read More
WEBINAR: UCIe PHY Modeling and Simulation with XMODEL
Join this webinar and see UCIe in action! This webinar presents the SystemVerilog models of a Universal Chiplet Interconnect Express (UCIe) interface, including both the analog circuits in the electrical layer and digital FSMs in the logical layer. The whole physical layer (PHY) model can be efficiently simulated in SystemVerilog,… Read More
Podcast EP165: The Impact of Mobiveil Across the Industry with Ravi Thummarukudy
Dan is joined by Ravi Thummarukudy. Ravi is CEO of Mobiveil, a fast-growing supplier of silicon intellectual property (SIP), platforms and IP-enabled design services with designs deployed in millions of units of silicon embedded in communications and consumer products worldwide.
Dan explores the silicon IP products, platforms… Read More
A Primer on EUV Lithography
Extreme ultraviolet (EUV) lithography systems are the most advanced lithography systems in use today. This article is a basic primer on this important yet complex technology.
The Goal: A Smaller Wavelength
The introduction of 13.5 nm wavelength continues a trend the semiconductor industry had been following a wavelength reduction… Read More
Rethinking Multipatterning for 2nm Node