Enabling RISC-V & AI Innovations with Andes AX45MPV Running Live on S2C Prodigy S8-100 Prototyping SystemQualifying an AI-class RISC-V SoC demands proving that…Read More
DAC News – A New Era of Electronic Design Begins with Siemens EDA AIAI is the centerpiece of DAC this year.…Read More
Arteris at the 2025 Design Automation Conference #62DACKey Takeaways: Expanded Multi-Die Solution: Arteris showcases its…Read More
Regardless of where you grew up you probably know the story of Alice in Wonderland. The story is over 100 years old, but holds up to the present day, thanks in part to some magic from Disney. It evokes visions of a place that elicits admiration and wonder, to create a place of magical charm. In the context of AI, it takes on a more relevant… Read More
In the ever-evolving world of Conversational AI and Automatic Speech Recognition (ASR), an upcoming LinkedIn Live webinar is set to redefine the speech-to-text industry. Achronix Semiconductor Corporation is teaming up with Myrtle.ai to bring you a webinar on October 24, 2023, at 8:30am PST.
Moderated by EE Times’ Sr. Reporter,… Read More
By Philippe Flatresse, Bich-Yen Nguyen, Rainer Lutz of SOITEC
Automotive radar is a key enabler for the development of advanced driver assistance systems (ADAS) and autonomous vehicles. The use of radar allows vehicles to sense their environment and make decisions based on that information, enhancing… Read More
Dan is joined by Richard Barnett, chief marketing officer and SaaS sales leader at Supplyframe. With more than 25 years of leadership experience in strategic marketing, sales and product management, Richard is recognized as a thought leader on supply chain and strategic sourcing transformation as well as digital marketing … Read More
Eng. Islam Nashaat received his B.Sc. and M.Sc. degrees from Ain Shams University, Cairo, Egypt, in 2010 and 2017, respectively. He joined Si-Vision as an Analog Physical Design Engineer in 2010, where he initiated the company’s CAD team in 2013, and became CAD and Physical Design Team Lead in 2016 after the company’s flagship … Read More
TSMC has been offering foundry services since 1987, and their first 3nm node was called N3 and debuted in 2022; now they have an enhanced 3nm node dubbed N3E that has launched. Every new node then requires IP that is carefully designed, characterized and validated in silicon to ensure that the IP specifications are being met and … Read More
Synopsys recently hosted a cross-industry panel on the state of multi-die systems which I found interesting not least for its relevance to the rapid acceleration in AI-centric hardware. More on that below. Panelists, all with significant roles in multi-die systems, were Shekhar Kapoor (Senior Director of Product Management,… Read More
You are probably familiar with the acronym PPA, which stands for Power/Performance/Area. Sometimes it is PPAC, where C is for cost, since there is more to cost than just area. For example, did you know that adding an additional metal layer to a chip dramatically increases the cost, sometimes by millions of dollars? It requires a … Read More
Two recent software-based algorithmic technologies –– autonomous driving (ADAS/AD) and generative AI (GenAI) –– are keeping the semiconductor engineering community up at night.
While ADAS at Level 2 and Level 3 are on track, AD at Levels 4 and 5 are far from reality, causing a drop in venture capital enthusiasm and money. Today,… Read More
As the focal point of the TSMC OIP ecosystem, TSMC has been driving important initiatives over the last few years to bring multi-die systems to the mainstream. As the world is moving quickly toward Generative AI technology and AI-based systems, multi-die and chiplet-based implementations are becoming essential. TSMC recently… Read More
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Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural Pivot