【2021預聘暨研發替代役計劃】台灣_MtM RD Engineer

Website TSMC
Description
1. Test-chip design and tape-out system developing
2. Process flow developing
3. New devices developing
4. Collaborate with related teams for Design Collaterals (DRM/DRC/LVS/SPICE/PDK) developing
Qualifications
1. Minimum Master degrees in an engineering and scientific field such as Materials Science, Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry or Optics.
2. Experienced in process integration or HV/BCD devices developing and characterization.
3. Innovative character in problems solving.
4. Familiar with TCAD simulation is a bonus
5. Process integration & CMOS characterization
6. Solid technical understanding of IC processing equipment, integrated flow, chemistry and physics.
7. Exhibit good and open communication skills; be able to work within cross-functional teams, including internal and external partners.
TSMC N3 Process Technology Wiki