System Integration Design Manager
Website TSMC
Role
1. Familiar with AP or CPU chip architecture and use the knowledge to develop system partition possibilities for new system integration.
2. Familiar with Memory architecture and use the knowledge to develop new Memory system architecture.
3. Explore new AP, CPU and Memory system architecture using new interconnect integration technology.
Responsibility
1. Study SoC chip function blocks for chip partition and re-integration using system packaging technologies.
2. Prepare system analysis report and propose new system integration methods for new interconnect technology development.
Qualifications
1. PhD.degree in Electrical Engineering / Communication Engineering.
2. 5+ years working experience in AP, CPU or Memory chip or system architecture design.
3. Experienced in AP, CPU or Memory product architecture work and know the system architecture very well.
4. Good command of English is required (written / spoken).
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