R&D Engineer

We are looking for creative and highly motivated R&D engineers with the potential to innovate on research for next generation semiconductor device technologies.

Successful candidates will work with various teams throughout TSMC as well as different global customers who are technology leaders in their industries. Candidates must own strong communication skills and work well in teams. They should possess strong technical problem-solving and analytical skills. Hands-on participation and a strong sense of ownership is highly required in these job positions. Moreover, candidates will have the opportunity to significantly impact the expansion of TSMC’s business and growth as future technical leaders of the global semiconductor technology research community.

Job Description

You can see the main responsibilities for each position below:

R&D Device/Integration Engineer

Work on advanced FEOL/MOL new knobs and integration development for leading edge technology.
Design innovative structures and process flow to enhance device stress for performance and stress metrology development.
Work with various teams (Module, Lithography, Device, Platform, TCAD) to identify critical paths and evaluate/develop new processes for leading-edge technology.
Carry out logic and SRAM cell layout/density/pattern evaluation for leading edge technology.
Develop new transistor/device/emerging memory characterization methodologies, testing procedures and analysis pipelines.
Establish algorithm development infrastructure to accelerate performance benchmarking.
R&D Advanced Module Engineer (Etch/CMP/Epi/Metal/Dielectric/Litho/Diffusion/Metrology)

Work on advanced module process development and baseline sustaining for leading-edge technology (N3 and beyond).
Collaborate with Integration/Device/Fab to deliver module processes for new technology nodes.
Execute process stability/manufacturing improvement for yield and reliability qualification.
Perform process/tool transfers to volume manufacturing.
APR/ Physical Design Engineer

Execute physical implementation of advanced chip technology.
Develop and innovate design methodologies for advanced technology challenges.
Be responsible for 16/10/7/5nm chip implementation for internal or customer projects, and for EDA tool enablement and customer support.
Process Design Kits (PDK) Engineer

Deliver innovative solutions for MtM HV/BCD/SOI/specialty process nodes.
Be responsible for MtM specialty techfile development, QC, and corresponding EDA tool certifications.
Inject innovative ideas into MtM specialty techfile generation or QC flow to further reduce development cycle time and improve quality.
Work closely with process, design/device, modeling and layout engineers to deliver the highest quality PDKs.
Co-work with TSMC internal (RD/Model/..etc), external customers and 3rd party EDA partners.
Standard Cell Design Engineer

Be responsible for advanced node standard cell circuit design.
Analyze circuit robustness and perform circuit optimization.
Develop subthreshold voltage circuit design for IoT applications.
Work on pathfinding and innovation of circuit designs for leading-edge tech nodes.
R&D 3DIC Packaging Engineer

Develop SoC/ASIC & package architecture design for high performance computing with High-bandwidth Memory (Server, Networking, AI, AR…etc) applications.
Execute SI/PI/RF/EMI validation for system requirements on eye diagram, jitter, latency, IR drop, cross-talk, and SSN specs, from chips to PCBs.
Develop system integration designs and requirements based on SiP, PoP, PiP, Chip stacking, and other 3DIC technologies.
Work with marketing/technology teams on technology competitive analysis and develop package technology road maps for future product requirements.
Qualifications

A minimum of a M.S. degree in Electrical Engineering, Material Science, Chemical Engineering, Chemistry, Physics, Computer Science or a related Engineering discipline. A Ph.D. degree is preferred.
Strong sense of ownership, ability to effectively deal with ambiguity and conduct independent research is required
Technical problem-solving and analytical skills, based upon fundamental, rather than empirical models, is required.
Good teamwork and interpersonal skills, able to work on cross-functional and geographically dispersed teams with diverse backgrounds.
Excellent English and Mandarin written and spoken communication skills is required.