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Principal Engineer

Principal Engineer
by Daniel Nenni on 08-23-2020 at 7:09 pm

Website TSMC

Senior Engineer

Provide chip implementation support in adv. semiconductor processing (such as N7, N5). Implement and verify physical design and support test chip tape out, including defect detection circuit design, test design for pin connection and routability analysis; resolve tool and flow issues. Take charge of APR (automatic placement and route) to help customers to complete chip implementation fitting company’s manufacturing environment.

Require: Master’s degree in Electrical Engineering. 2 years’ experience in job offered. Experience background in physical design implementation, test chip tape out, defect detection circuit design, and test design for pin connection and routability analysis.

Work Site: 11921 N. MOPAC EXPWY., Ste. 310, Austin, TX 78759

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To view the job application please visit tsmc.taleo.net.