Substrate / Advanced Packaging Manager

As chip sizes increase and packaging technologies become more complex, substrate engineering is emerging as a critical domain. This role supports TSMC’s leadership in 3DIC and advanced packaging by extending expertise beyond chip-level design into packaging-level integration. The team is addressing challenges such as warpage, power delivery, thermal management, and material innovation. Future evolution includes Chip-on-Wafer-on-PCB (CoWoP) under TSMC’s System Technology Optimization program.

The position requires strong design and technology expertise to define future customer requirements, focusing on integrated packaging, dielectric parameters, high-speed I/O, and trade-offs that directly impact system performance. This role is critical in shaping the direction of 3DIC development.

We are seeking a highly skilled and motivated Substrate / Advanced Package Manager to join our cutting-edge 3DIC design team. The ideal candidate will have a strong foundation in semiconductor physics, mechanical engineering principles, and EDA (Electronic Design Automation) tools, with a passion for innovation in advanced packaging design. The role involves design, simulation, and modeling of complex substrate and packaging technologies to support next generation 3DIC applications.

Job Responsibilities

1. Design, simulate, and optimize advanced packaging for 3DIC applications.
2. Collaborate with cross-functional teams to define specifications and requirements.
3. Perform modeling of warpage, stress, reliability, and thermal performance using industry-standard EDA tools.
4. Formulate and solve problems in research-driven, often ambiguous domains.
5. Provide guidance on high-speed I/O modeling and integration.
6. Develop and maintain documentation, including specifications, test plans, and design reviews.
7. Stay current with industry trends, tools, and technologies in advanced packaging.

Job Qualifications

Minimum Qualifications

1. Master’s or Ph.D. degree in Electrical Engineering, Mechanical Engineering, or a related field.
2. 15+ years of hands-on expertise in advanced packaging technologies and substrate design.
3. Understanding of semiconductor device physics and packaging process technologies.
4. Strong knowledge of warpage, stress, and thermal effects in packaging.
5. Proven ability to drive solutions in ambiguous, research-oriented contexts.
6. Excellent problem-solving, analytical, and communication skills.
7. Strong collaboration skills, with the ability to mentor junior engineers.
8. Ability to balance strategic insight with hands-on technical execution.

Preferred Qualifications

1. Experience with reliability, IR/EM, and multi-physics analysis.
2. Familiarity with machine learning techniques for design optimization.
3. Patents, publications, or demonstrated innovation in substrate or packaging domains.

Success Metrics

1. Ability to provide impactful, data-driven suggestions that influence design direction.
2. Effective use of modeling and simulation to validate proposals.
3. Establishing trust and credibility with global teams.
4. Enabling adoption of new technologies within the 3DIC ecosystem.