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This position is for a Senior Process Integration supporting 200 and 300mm wafer fabs.
The candidate will be responsible for facilitating the successful introduction of new process technology, ramping up yield, supporting existing technology, and internal and external RMA support.
Key tasks
Support RMA return of customers and drive the root cause understanding.
To monitor electrical performance trends, support general/urgent fab operational issues, scrap investigation and analysis for process change review boards.
Monitor OOC, maintain good CPK for Electrical data and monitor inline SPC parameters.
Develop and improve yield characterization and data analysis methodologies to rapidly determine yield limiters, correlation to in-line defectivity and metrology, and electrical parametric signals.
Performing defect characterization and defect source analysis at new technology process development phase and drive for defect elimination CIP solution.
NTI Passdown Preparation: Inline/ ET Data preparation and Root cause (e.g., FDC) investigation in case of deviations including update of NTI pass down document’s updates for FEOL and BEOL
Supports principal engineer with generation of reports, analysis of data and highlights deviations.
Supports Process Integration with setup of systems for data collection, like e.g., PCP (Process Control Plan) requests.
Run DOE to optimize process margins and determine process & ET specifications for new technology.
Identify and resolve process integration issues and related problems in the existing technology.
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