Senior Application Engineer

Summary / Role Purpose

Join the Ansys Customer Excellence team to partner with our customers to engineer what’s ahead, solve their real-world engineering problems, deploy Ansys software in their design workflows, and grow Ansys’ business. As a hands-on expert in Ansys products, you will use advanced-level engineering knowledge to provide technical pre-sales support, perform professional services, and help translate customer requirements into exciting new product features. You will be working within Electronics thermal management team and multi-disciplinary teams to advance your knowledge, experience, and business impact.

Key Duties and Responsibilities

• Lead/Assist in coordinating and executing all technical activities throughout the sales opportunity lifecycle such as technical discovery, product presentations, demonstrations, and evaluations.
• Responsible for providing best in class thermal management solutions involving electronics chip, Package and System.
• Collaborate with the cross regional and cross functional teams to establish Multiphysics simulation workflows and solutions.
• Implement new age product development methodologies such as model order reduction and machine learning.
• Work in advanced technology areas such as 5G, Industrial IoT.
• Participate in external and internal events to further enhance Electronics thermal simulation solutions, marketing, and professional growth.
• As a product expert with one or more Ansys products, interact with customers to understand their product design needs and engineering design workflows; analyze how to address customers’ requirements using Ansys products and platform; articulate Ansys’ value proposition.
• Collaborate with the Ansys product development teams to translate customer requirements into exciting new product features; test new releases of Ansys products on industrial problems.
• Support Ansys field and digital marketing
• Contribute to consulting services, conduct introductory and/or intermediate training classes.
• Create custom workflows involving Ansys tools and machine learning libraries.

Minimum Education/Certification Requirements and Experience

• Required education and degree type: Master’s degree in Aerospace/Mechanical/Civil Engineering or related engineering field with 3~6 years of experience in electronics thermal simulation
• In depth understanding and fundamentals related to fluid dynamics and heat transfer is a must.
• Familiarity with package, printed circuit boards and connector design processes
• Experience in using programming language (Python, C#, Javascript etc.) for automating simulation workflows.
• Experience with using ANSYS Icepak or other thermal management simulation software involving real world, industry level applications.
• Experience having worked on machine learning projects.
• Familiarity with any machine learning library – TensorFlow, PyTorch, Theano, CNTK.
• Logical problem-solving, strong interpersonal and communication skills, fluent in writing and speaking English.
• Strong organizational and time management skills, possesses a sense of urgency.
• Projects a professional image and demonstrates business acumen, driven to succeed.
• Ability to travel domestically up to 25% of time

Preferred Qualifications and Skills

• Deep understanding of electronics industry trends, technologies, engineering environment, product design complexity, development challenges etc.
• Ability to understand customer requirements and generate requirements document.
• Flexibility and adaptability to learn and understand new technologies.
• Ability to research and debug software-related issues.