RD Pathfinding Process Engineer (Interconnect Development)
Website TSMC
Description
1. Development of new materials, processes, and architecture for back-end-of-line interconnect
2. Initiate joint-development projects with world-class universities/research centers
Qualifications
1. MS or Ph.D. in Chemical Engineering, Material Science, Chemistry, Physics, or a related engineering discipline; well-understanding in thermal dynamics, kinetics, and solid-state physics would be an added advantage.
2. Hands-on participation and a strong sense of ownership is required
3. Strong technical problem-solving and analytical skills, based upon fundamental, rather than empirical models is required
4. Excellent written and spoken communication skills is required
5. Experience in 2D materials development would be an added advantage
6. Must be effectively bilingual in Mandarin and English
Primary Location: Taiwan-Hsinchu
Job: R&D
Job Posting Date: May 29, 2020
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