R&D Module Engineer
Website TSMC
Job Responsibilities
1. Equipment Engineer (RDPC – 3DIC)
2. Process Engineer (RDPC – 3DIC)
3. R&D Advanced Tool and Module Process Engineer
4. R&D Nano Patterning Technology Development (NPTD) Engineer
Job Qualifications
1. Passionate about the development of world-leading technologies.
2. Master’s degree or above in an engineering or scientific field such as Materials Science Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry or Optics.
3. Solid technical understanding of IC processing equipment, integrated flow, chemistry, and physics.
4. Exhibit good and open communication skills and be able to work within cross-functional teams, including internal and external partners.
5. Fluent in English.
6. Skills in AI and programming are preferred.
7. Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles. Having knowledge of machine learning or artificial intelligence is an added advantage.
8. Flexibility in changing priorities and responsibilities to support business needs.
9. Hands-on participation on process or hardware and a strong sense of ownership.
10. Willing to make frequent fab presence.
11. Strong technical problem-solving and analytical skills, based upon fundamental, rather than empirical models is required.
12. Excellent written and spoken communication skills are required.
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To view the job application please visit careers.tsmc.com.


Intel to Compete with Broadcom and Marvell in the Lucrative ASIC Business