Post Fab Heterogeneous Integration Engineer

About GlobalFoundries:

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Summary of Role:

GlobalFoundries Fab 8 is seeking a highly skilled, experienced, versatile, and motivated Post Fab Heterogeneous Integration Engineer in Malta, New York. The main responsibility of this position is to develop a wide range of novel wafer level processes (Hybrid Wafer Bonding, TSV, TOV etc.), Die to Wafer Bonding & module assembly processes as well as to qualify advanced packaging offerings for GlobalFoundries customers. The scope of these solutions cover differentiated packaging incorporating Hybrid Wafer Bonding, Si Photonics, 2D/2.5D/3D technologies from multiple silicon technology nodes.

Essential Responsibilities Include:

• Lead process development efforts and planning by working with the unit process engineers and directly with the tools & materials the Malta Advanced Semiconductor fab, Fishkill Advanced Semiconductor Fab as well as OSATs to develop new wafer level, die level & packaging processes
• Develop expertise in the processes, materials and tooling leveraging available characterization resources
• Drive mechanistic understanding of failure modes
• Develop integration schemes to continuously improve yields and to reduce cycle-time & costs. Generate IP related to novel wafer integration & packaging technology
• Drive end-to-end process integration and planning to enable new capability planning, early product prototyping and qualification across multiple programs

Other Responsibilities:

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs

Required Qualifications:

• Education – BSc Engineering or Material Science
• Experience – at least 5 year of demonstrated relevant technical experience
• Travel – First year majority of time training in East Fishkill, NY then 10% or less
• Language Fluency:  English (Written & Verbal)

Preferred Qualifications:

• MS or PhD in Engineering or Material Science
• 5+ year Experience in semiconductor packaging technology