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PCB and Package Design Lead

PCB and Package Design Lead
by Admin on 12-20-2022 at 1:17 pm

Job Description

The INTEL NEX Cloud Networking Group (NCNG) seeks outstanding engineers to contribute to the development of cutting-edge semiconductor platforms. You will be exposed to High-Speed I/O protocols such as PCIe Gen6, DDR5, and PAM4 112Gbps Ethernet, which are a part of our Ethernet Infrastructure Processing Unit (Intel IPU) and Foundation NIC (FNIC) 200G Ethernet product lines.

We propose a position in a dynamic and flexible workplace, working directly with highly capable design, system, and pre/post-silicon teams within the organization.

As the PCB and Package Design lead, you will be responsible for the project management, planning, and execution of the team’s PCB and Package deliveries across several programs. Your team will define the scope of all package and PCB design requirements, document them, and ensure compliance to ensure that the product specifications and performance requirements are met.

You will be responsible for driving the product design from the planning phase through design tape-outs, as well as providing post-tape-out support to our stakeholders as necessary. Your team will be responsible for negotiating and implementing Signal and Power Integrity guidelines aspects, compliance, and interoperability for the NCNG product portfolio across PCIe, Ethernet, DDR, Clocks, and Miscellaneous I/O interfaces.

In addition, your team would be responsible for identifying/qualifying new hardware solutions, providing technical leadership to working groups/task forces to resolve hardware, schematics, layout, and DFx issues via debugging and reviews, and managing the selection of parts/components.

Qualifications

— Required Skills and Experience– –

  • Electrical Engineer M.Sc. with over 6+ years / B.Sc. with over 8+ years of relevant experience
  • Strong understanding of EM concepts and transmission line theory – Knowledge of CAD tools: Cadence Allegro / Mentor Expedition, or equivalent
  • Familiar with PCB and Package layout technics
  • Hands-on lab work experience, good debugging skills, ability to analyze problems, diagnose the root cause and apply corrective action
  • Involving in the Package Design Working Group to work with key internal/external partners to comprehend the detailed design requirements.
  • Managing the package design schedule partnering with stakeholders to ensure package tape-out per schedule.
  • Good understanding of the Package/Assembly cost and leveraging design methods to lower the package cost.
  • Leading the package design reviews to ensure stakeholder approval and design compliance with requirements.
  • Strong verbal and written communication skills in English for interacting with design, evaluation and production engineers, customers, technical marketing engineers, and program managers
  • Excellent documentation and leadership skills
  • Comprehensive understanding of system architecture
  • Test measurement instrument hands-on operation

— Additional Skills and Experience — –

FPGA, and Verilog coding skills

Inside this Business Group

The Network & Edge Group brings together our network connectivity and edge into a business unit chartered to drive technology end to end product leadership. It’s leadership Ethernet, Switch, IPU, Photonics, Network and Edge portfolio is comprised of leadership products critically important to our customers.

Apply for job

To view the job application please visit jobs.intel.com.

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