Packaging Design Engineer

We are looking for an Advanced Package Design Engineer to join our team. Ensuring Synopsys IP test chip packages meets performance requirements. Candidate with advanced package design and model extraction experience required. Can-do attitude, quick learning, and solid electronic skills are assets.

You will be working with a global, high skilled and very supportive team

Responsibilities

• Responsible for advanced package designs, such as silicon interposers, RDL fanout packages and silicon bridge packages
• Models, and analyze advanced package designs and their associated PCB designs
• Coordination of package design phases, and flow
• Resolves a wide range of issues in creative way regularly
• Provides regular updates to manager on project status
• Represents the organization on business unit projects

Requirements

• Bachelor’s degree in electrical or Electronic Engineering
• Minimum of 5 year of industry relevant experience
• Advanced circuit and transmission line theory knowledge
• Experience with 3DIC packaging and 3D field solvers (e.g., HFSS)
• Good verbal and written English communication skills
• Familiarity with both Windows and Linux operating systems