Intelligent Manufacturing System Engineer

Website TSMC
Key Systems and Functions:
1. Intelligent Scheduling Development Department (ISDD): Optimizes workflows to enhance efficiency, reduce cycle times, and ensure timely deliveries.
2. Intelligent Process Control System (IPCS) : Achieves nanometer precision and ensures chip quality with real-time anomaly detection and diagnostics.
3. Advanced Quality System Development (AQSD) : Uses data analytics and machine learning to improve product quality and deliver high-quality wafers.
4. Vision and Numeric AI Productization (VNAP) : Employs vision AI for defect detection, pattern recognition, and automated inspection to increase yield and enable predictive maintenance.
5. Digital Workflow Technology Development (DWTD) : Streamlines processes with automation, reducing manual work and enhancing efficiency.
6. Manufacturing Technology RD (MTRD) : Develops cutting-edge technologies to address manufacturing challenges, driving innovation in productivity and quality.
7. Infrastructure and Platform Engineering Department (IPED): Builds scalable systems with cloud-native solutions and DevOps practices for seamless global integration.
8. Facility Computer Integrated Manufacturing (FDCIM) : Optimizes fab energy consumption, material management, and resource utilization.
9. Engineering Computer Integrated Manufacturing (ECIM) : Specializes in sensor data governance, fault and anomaly detection, and predictive analysis for equipment health to enhance efficiency and performance.
10. Computer Integrated Manufacturing (Site Service): HCIM, TCCIM, TCIM, AASD
Job Responsibilities
1. System Development and AI Integration:
(1) Develop intelligent manufacturing systems with automation and advanced control.
(2) Integrate AI to improve productivity and quality.
(3) Build real-time data systems for better decision-making.
2. Problem Solving:
(1) Translate business needs into technical solutions.
(2) Use big data to identify and solve manufacturing challenges.
3. Project Management:
(1) Ensure clear communication between teams and users.
(2) Lead cross-departmental solutions focusing on integration and performance.
Job Qualifications
Educational Background:
1. Master’s or above in relevant fields.
2. Preference for Ph.D. or research experience in AI, Data Science, or Semiconductor fields.
Technical Skills:
1. Proficient in programming (e.g., Python, SQL, C#, Java, React, TensorFlow, CUDA).
2. Familiar with machine learning, data visualization, statistical analysis, and system development.
3. Strong logical thinking and communication skills.
4. Project management experience is a plus.
Preferred Experience:
1. Open to fresh graduates.
2. Experience in semiconductor manufacturing or AI/ML applications.
3. Hands-on with MLOps/AIOps, web development, and front-end/back-end development.
4. Knowledge of automation tools, low-coding platforms, and cloud-native technologies is a plus.
Personal Attributes:
1. Self-motivated, result-oriented, eager to learn.
2. Strong teamwork, problem-solving, and communication skills.
Additional Information:
1. Work Locations:
(1) Hsinchu, Taichung, Tainan, Kaohsiung, or Taoyuan.
(2) Final location determined based on organizational and individual needs.
2. On-call Requirements:
(1) Occasional low-frequency on-call support; specifics discussed during the interview.
3. Interview Process:
(1) 1st Manager interview
(2) HackerRank test
(3) On-site personality and English test (can be replaced with an official English test script) (Optional)
(4) HR interview (Optional)
(5) 2nd Manager interview (Optional)
Apply for job
To view the job application please visit careers.tsmc.com.
TSMC 2025 Technical Symposium Briefing