Intelligent Manufacturing System Engineer

Website TSMC
Key Systems and Functions:
1. Intelligent Scheduling Development Department (ISDD): Optimizes workflows to enhance efficiency, reduce cycle times, and ensure timely deliveries.
2. Intelligent Process Control System (IPCS) : Achieves nanometer precision and ensures chip quality with real-time anomaly detection and diagnostics.
3. Advanced Quality System Development (AQSD) : Uses data analytics and machine learning to improve product quality and deliver high-quality wafers.
4. Vision and Numeric AI Productization (VNAP) : Employs vision AI for defect detection, pattern recognition, and automated inspection to increase yield and enable predictive maintenance.
5. Digital Workflow Technology Development (DWTD) : Streamlines processes with automation, reducing manual work and enhancing efficiency.
6. Manufacturing Technology RD (MTRD) : Develops cutting-edge technologies to address manufacturing challenges, driving innovation in productivity and quality.
7. Infrastructure and Platform Engineering Department (IPED): Builds scalable systems with cloud-native solutions and DevOps practices for seamless global integration.
8. Facility Computer Integrated Manufacturing (FDCIM) : Optimizes fab energy consumption, material management, and resource utilization.
9. Engineering Computer Integrated Manufacturing (ECIM) : Specializes in sensor data governance, fault and anomaly detection, and predictive analysis for equipment health to enhance efficiency and performance.
10. Computer Integrated Manufacturing (Site Service): HCIM, TCCIM, TCIM, AASD
Job Responsibilities
1. System Development and AI Integration:
(1) Develop intelligent manufacturing systems with automation and advanced control.
(2) Integrate AI to improve productivity and quality.
(3) Build real-time data systems for better decision-making.
2. Problem Solving:
(1) Translate business needs into technical solutions.
(2) Use big data to identify and solve manufacturing challenges.
3. Project Management:
(1) Ensure clear communication between teams and users.
(2) Lead cross-departmental solutions focusing on integration and performance.
Job Qualifications
Educational Background:
1. Master’s or above in relevant fields.
2. Preference for Ph.D. or research experience in AI, Data Science, or Semiconductor fields.
Technical Skills:
1. Proficient in programming (e.g., Python, SQL, C#, Java, React, TensorFlow, CUDA).
2. Familiar with machine learning, data visualization, statistical analysis, and system development.
3. Strong logical thinking and communication skills.
4. Project management experience is a plus.
Preferred Experience:
1. Open to fresh graduates.
2. Experience in semiconductor manufacturing or AI/ML applications.
3. Hands-on with MLOps/AIOps, web development, and front-end/back-end development.
4. Knowledge of automation tools, low-coding platforms, and cloud-native technologies is a plus.
Personal Attributes:
1. Self-motivated, result-oriented, eager to learn.
2. Strong teamwork, problem-solving, and communication skills.
Additional Information:
1. Work Locations:
(1) Hsinchu, Taichung, Tainan, Kaohsiung, or Taoyuan.
(2) Final location determined based on organizational and individual needs.
2. On-call Requirements:
(1) Occasional low-frequency on-call support; specifics discussed during the interview.
3. Interview Process:
(1) 1st Manager interview
(2) HackerRank test
(3) On-site personality and English test (can be replaced with an official English test script) (Optional)
(4) HR interview (Optional)
(5) 2nd Manager interview (Optional)
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