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Experienced Signal and Power Integrity engineer

Experienced Signal and Power Integrity engineer
by Admin on 10-17-2022 at 2:31 pm

Website Arm

Are you enthusiastic about new technologies? This position is an excellent opportunity for an experienced and highly motivated package design engineer to join the SIPI (Signal Integrity and Power Integrity) team and work on the future of System-in-Package designs, focusing on finding the optimum implementations that will improve Arm IP performance.

The semiconductor industry transitioned from multichip modules, then to SoC and is now moving into advanced System-in-Package (SiP) which changes the influence of Arm IP. Arm IP will begin to span multiple pieces of silicon in a system and optimizing this interaction is important for internal development and enabling partner success.


The Experienced Signal and Power Integrity engineer will be in charge of creating and analysing novel System-in-Package designs. State of the art power delivery techniques and interfaces will be key in emerging technologies as advanced packaging is growing in industry importance. The engineer will need to create or monitor package designs then running customized packaging analysis tools. Senior engineers are expected to play a tech lead role.

The engineer will be responsible for the definition, design, and verification of package designs. Candidate will work closely with teams in US, UK, and other Arm locations on need basis. Candidate will interact with digital designers (P&R) on the models needed to conduct efficient and accurate analysis. Clear communication with other team members is important. Candidate may be expected to monitor lab evaluations of the on post-silicon chip, including debugging and solving any possible system level issues.

The job will be based out of Sophia or other Arm premises.

Required Skills and Experience :

  • Engineering degree or equivalent
  • You hold ideally 5 or more years of experience in SI and/or PI analysis
  • Be very good at working with SIPI analysis environments (Ansys suite, Cadence, or other)
  • Have deep understanding of multi-port matrixes (S, Y, Z parameters)
  • Possess good understanding of electromagnetic extraction methodologies and limitations
  • Good understanding of package drawing to effectively drive a design engineer and perform package drawing development tasks on occasional basis

“Nice To Have” Skills and Experience :

  • Have good understanding SoC implementations and models (power models, impedance profiles of power delivery networks)
  • Knowledge in packaging manufacturing steps, and their constraints
  • A good understanding of electromagnetic influences

It is important for the successful applicant to:

  • Be able to mentor other package drawing engineers
  • Proficient in English with good communication skills, oral and written
  • Self-motivated, looking to accept new challenges
  • Must be a passionate self-starter and great teammate
  • Attention to detail
  • Pro-active and pragmatic with regards to problem solving
  • Be willing to iteratively improve designs and repeatedly attempt to develop solutions to difficult problems

In Return:

You will work directly with engineers across the company to build next-generation systems. You will have a direct impact on our bottom line and the ability to deliver improvements for our customers. You will be part of a growing, fast-paced, and fun team. You will have ownership for the implementation of your work.

We have a friendly and high-performance working environment, where Arm offers a competitive benefits package in France including private medical insurance (employee and family), 25 days annual leave, 20-day sabbatical every four years, supplementary pension and reduction in working hours (11 days).

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To view the job application please visit

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