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UMC has released that it doesn't have the resources to develop it's own 14nm process, instead it'll introduce a 18nm node: UMC developing 18nm process technology
Thoughts?
TSMC should recognize that perhaps its time to join forces with UMC. With Global Foundries joining forces with Samsung (and paying for a portion of their 14 nm development costs), TSMC could license their 16 nm process node to UMC in return for money & perhaps a joint development of the 7 or 10 nm node.
I remember UMC turning down the opportunity to license Samsung's 14 nm node about a year ago. I got to wonder if part of UMC's reason was because of TSMC.
Well, while the competitors are already developing their 10nm offers, UMC is moving to 18nm, whatever that means (most likely a kind of 28nm + FinFET).
Bye bye leading edge.
It is clear that their only option to compete is by offering lower prices (that is exactly what happened at 28nm).
Well, while the competitors are already developing their 10nm offers, UMC is moving to 18nm, whatever that means (most likely a kind of 28nm + FinFET).
Bye bye leading edge.
It is clear that their only option to compete is by offering lower prices (that is exactly what happened at 28nm).
UMC has released that it doesn't have the resources to develop it's own 14nm process, instead it'll introduce a 18nm node: UMC developing 18nm process technology
Thoughts?
Interesting times for engineers; tougher times for people who have to make the business decisions .
I assume all layers (except maybe poly cut) will be single patterned then. Good for mask cost, a little bit worse for cost/transistor. If not FinFET I think this process would also then be a perfect candidate to have a FDSOI version of it; e.g. a ST-UMC joint development program if such a thing is possible from company culture stand point.
TSMC should recognize that perhaps its time to join forces with UMC. With Global Foundries joining forces with Samsung (and paying for a portion of their 14 nm development costs), TSMC could license their 16 nm process node to UMC in return for money & perhaps a joint development of the 7 or 10 nm node.
I remember UMC turning down the opportunity to license Samsung's 14 nm node about a year ago. I got to wonder if part of UMC's reason was because of TSMC.
If you look at the history the same was said about GlobalFoundries challenging TSMC at 28nm. Do you remember the whole Common Platform thing? What a tremendous failure that was. So maybe TSMC had a right to feel overconfident at 16nm.
I'm not sure what UMC has to offer TSMC other than a trusted second source. TSMC called GlobalFoundries the "Samsung accessory" after the 14nm licensing deal. I felt it was truly a big step forward for Samsung in the foundry business but if they do not continue at 10nm and 7nm it was all for naught in my opinion.
My guess is that UMC 18nm, if that is a real thing, will be planar and it will fail. GlobalFoudnries has a 22nm SOI platform that would be much more competitive if you are going for a non double patterning process:
It will be interesting to see what flavor of 14nm it is. I will check more on my next Taiwan trip. It is probably the IBM version. I have heard absolutely nothing inside the fabless semiconductor ecosystem about an 18nm version so that is probably just DigiTimes making things up again.