TechInsights Platform
China Breaks Through Restrictions with Advanced Chiplet Strategy: 3D-IC Breakthrough in Chinese Ethereum Miner
TechInsights Reveals Design of the Jasminer X4 with DBI Hybrid Bonding. Get the Disruptive Event Brief to learn more.
TechInsights made a remarkable discovery on the Jasminer X4 Ethereum miner ASIC, developed by China-based crypto mining machine manufacturer Jasminer. This design marks the industry’s first-ever application of DRAM to logic direct bond interconnect (DBI).
TechInsights found hybrid bonding technology in Yangtze Memory Technologies Company’s (YMTC) Xtacking 3.0 architecture, where logic circuits were bonded to a separate wafer with storage cells in their 3D NAND products. Jasminer X4 uses this technology differently—it represents the first instance where the logic circuits have been bonded directly to DRAM.
The Jasminer X4 showcases the ability of a Chinese company, under trade restrictions, to combine matured technologies to create high-performance, cutting-edge applications creatively. A sizable 32 mm × 21 mm logic die employs the earlier XMC (Wuhan Xinxin Semiconductor Manufacturing Co.) planar 40/45 nm CMOS technology. The large die is patterned using two masks, which could represent a design workaround for a reticle constraint. The flip chip is assembled within the package.
Additional findings covered in the Disruptive Event Brief:
- Xilinx Zynq FPGA on the board containing the Mining ASIC.
- Jasminer X4 is the first Ethereum miner ASIC to utilize a storage mining design.