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TSM is preparing capacity for a large leap into RRAM memory?
Apple wants Crossbar for a forward leap over the competition in phones and portables?
What would the impact of TSM being a significant player in memory be?
Is it possible?
Where is the competition in this?
I have been following Crossbar for over two years as it has been being developed and feel it is close. I also feel this could change the mobile game, making the phone/computer even more central in computing/communicating.
The RRAM technology has been around as a research concept, however commercial efforts have only been able to muster Kilobyte capacity, so they are about 1,000,000X behind DRAM technology today.
HP calls this technology a Memristor.
Either way, it has to leap out of the research labs into a more competitive commercial niche to succeed.
Daniel, what does the following say about the schedule? Do you feel it's accurate and what do you think this says about time to market?
Crossbar to Demonstrate Breakthrough Resistive RRAM Innovation at IEDM 2014
December 08, 2014 Crossbar, Inc., a start-up company pioneering a new category of very high capacity and high-performance non-volatile memory, today announced it will be disclosing another major technology breakthrough in their development of Resistive RAM (RRAM) at next week’s IEEE International Electron Devices Meeting (IEDM). Continuing to meet key technological milestones, the company first unveiled its RRAM technology in August 2013 and then demonstrated pre-production 1MB arrays using Crossbar’s patented “1TnR” technology for read/write operations in June 2014.
Any technology company can issue a press release about the potential for their next breakthrough. I'll really believe it when a customer buys one of these devices and uses it inside of a real commercial application. Until then, it's potentially a breakthrough.
Staf and Dan, What do are your opinions of TSM developing the production process? Do they have the best shot of anyone? Could this be a below the radar game changer for TSM? Also, could Apple be bank rolling this to give them a competitive edge? I feel of any company TSM would have the best shot at developing the production process due to their diverse experience. Just my thoughts, opinions and observations welcome.
One of the problems for 3D stacked dies with TSVs with dies from different foundries and stacking at still another one is who to blaim when there are yield problems in the final product. One possible solution is to offer everything in-house: e.g. ASIC, DRAM, NVM, ... In this respect I think currently TSMC has a disadvantage to Samsung and that is the reason they are (quietly) looking at DRAM and NVM production themselves. But this is pure my opinion.
Staf and Dan, What do you think the reason is that TSM took on the project of developing the production process for Crossbar RRAM about eighteen months ago?
This must have some tie in to the December 14 announcement. Any idea what's going on?
Staf - you commented last year on this topic. I'm meeting a guy from Crossbar next week at ARM TechCon. Wondering if you had any updated opinions on this topic? I won't quote you -Best
Bernard, please let me know what you find out. I have been following this for three plus years. I even asked the TSM rep at a lunch and learn sponsored by Tanner about three years ago and he knew nothing, supposedly? Any insights would be greatly appreciated. Thanks
As I am now in the design services group of imec I don't follow the progress in the technology development in depth anymore, so no new insights on this topic. But I think it is always good to know who one can blame if your assembled product doesn't work and you followed all guidelines.
-Best