delong.height
Active member
It's not financial engineering, it's a pivot in how capital should be allocated, and it's a norm. I think it's a great investment strategy vs TSMC's. TSMC is going down the old path of Intel, reusing equipment that were for older node and retooling them for newer node. And I think Intel's approach will open up a pandora. TSMC is much cheaper than Intel, so what? who cares? Intel is going to spend half of the CapEx to have a same level of capacity along with government credit and support when TSMC is raising its prices thanks to Nvidia, but its American fab won't be cheap either. So I think to Pat's credit, one of the biggest hurdle (cost) to compete with TSM is gone."I think what's important to note is, this is likely the last SCIP deal that we are contemplating. And so we did a SCIP1, we did a SCIP2. It really helps us protect the balance sheet and prosecute the strategy, during a period of time where we know we're playing catch-up and our P&L and cash flow is under-earning."
Intel desperately needs cash to save its deteriorating financial situation. For example, to continuously pay dividends while in fact it can't afford to do so. Another problem is Intel is required to match grants US, Germany, Ireland, and Israel government give to it to complete those new fabs. It's a huge amount of cash that will keep biting into Intel's financial health.
"Fab light? Asset light? I still do not get it."
One thing for sure, it's heavy in financial engineering.
And even when Intel may need to give up half of their profits on fabs. It doesn't matter because those are just wafers, there are still many steps involved to make a fully functional system. And that's where Intel shine. Whenever we talk about Intel, remember it's still not a pure-foundry company like TSMC. It's Intel foundry and Intel products. What's lost in foundry will be made up in product until the older node will make profit on a non-depreciating basis. So if they have to give up half of their profit to double their internal capacity than they could do themselves, I think it's a good strategy overall. They can pull back all their design back to in house, ultimately hurting TSM along the way, and I think Pat loves to see. Pat is a competitive guy, but clearly he doesn't want his competitor to get unfair advantage against Intel, this includes AMD, Nvidia, Apple, Qualcomm, Arm, and TSM. This means a decoupling of TSM and its strong ecosystem. Also Intel will make money at packaging and design.