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  1. F

    ISSCC 2026 Samsung Electronics demonstrated a 16Gb DRAM

    The cell-over-periphery bonding benefit can apply to conventional planar ("6F^2")DRAM cells.
  2. F

    Terafab 21 March 2026

    The key understatement from that article: "Terafab will probably not succeed on exactly the schedule first announced."
  3. F

    TSMC Chairman C.C. Wei Awarded Honorary Doctorate by Asia University Taiwan

    Aging populations everywhere drive a big market for caregiver robots.
  4. F

    Samsung Electronics plans over $73 billion investment to lead in AI chip sector

    They are not very clear that it's a fab expansion. Samsung Electronics plans to spend at least 110 trillion won ($73.3 billion) on facilities and research and development (R&D) this year, positioning itself to meet robust growth in chip demand while leaving room for sizable merger and...
  5. F

    Samsung Electronics plans over $73 billion investment to lead in AI chip sector

    Always more DUV than EUV.
  6. F

    Is It Really Impossible To Cool A Datacenter In Space?

    Yeah, cooling being radiation-limited, and also heating from the Sun, Earth, and elsewhere. At the end, he acknowledges we haven't even talked about the power supply in space.
  7. F

    Samsung and AMD Expand Strategic Collaboration on Next-Generation AI Memory Solutions

    Is there an implied exclusivity? The use of the term "primary" begs the question of when they would go the secondary or further.
  8. F

    Samsung and SK hynix are scaling back their DRAM expansion plans: Is there concern about potential overcapacity?

    Samsung is also considering HBM "relief" like Groq and HBF.
  9. F

    Inside NVIDIA Groq 3 LPX: The Low-Latency Inference Accelerator for the NVIDIA Vera Rubin Platform

    784 billion transistors over 8 chips makes more sense.
  10. F

    Inside NVIDIA Groq 3 LPX: The Low-Latency Inference Accelerator for the NVIDIA Vera Rubin Platform

    4GB is a lot of SRAM (is it supposed to be 4 Gb)? From: https://www.cna.com.tw/news/ait/202603170011.aspx
  11. F

    Samsung and SK hynix are scaling back their DRAM expansion plans: Is there concern about potential overcapacity?

    16. March 2026 06:01 Samir Bashir The memory industry is currently raking in huge profits thanks to the AI boom, but behind the scenes, nervousness is growing. While Samsung and SK hynix are benefiting massively from the current demand for DRAM and HBM, that is precisely the problem: anyone who...
  12. F

    Samsung Foundry nabs Nvidia

    Groq already lost confidence in themselves last year: https://www.investing.com/news/company-news/groq-slashes-2025-revenue-projections-to-500-million--the-information-93CH-4158309 Investing.com -- AI chipmaker Groq has significantly reduced its 2025 revenue projections from more than $2...
  13. F

    Samsung Foundry nabs Nvidia

    Must be a big chip, i. e., hard to yield.
  14. F

    China’s No. 2 chipmaker Hua Hong readies 7 nm production as Beijing ramps up self-sufficiency drive

    So this is a fully domestically supplied fab?
  15. F

    BEOL M0 32nm with EUV Low NA0.33 Single Exposure, Nvidia cuLitho helps but not easy for HVM

    This cuLitho P32 print looks risky:
  16. F

    BEOL M0 32nm with EUV Low NA0.33 Single Exposure, Nvidia cuLitho helps but not easy for HVM

    I don't think these are realistic patterns, with such large gaps between line ends. Are they leaving room for SRAFs? Aside from the long lines which look like they didn't clear, these could be stochastic occurrences. In that case, the effectiveness itself will be stochastic, since defect...
  17. F

    Build China’s ASML

    Well, this may not age so well, as there is plenty of blur that does not come from ASML's machine, namely, the resist (from the electrons, and in a lot of cases, acids).
  18. F

    Build China’s ASML

    Also, the components of ASML's EUV systems are individually expensive and many would only be used just for those kinds of systems. Even something that may sound trivial like precision maglev vacuum stages. Hydrogen-proofing makes it sound less trivial.
  19. F

    Elon Musk kills résumés for chip hires and wants these 3 bullet points

    Well, "a résumé is still required to apply for most other jobs at Tesla in the U.S.—with some positions even calling for an “evidence of excellence” statement." https://fortune.com/2026/02/20/how-does-elon-musk-hire-dojo3-chip-team-no-resumes-3-bullet-points/
  20. F

    Build China’s ASML

    The article briefly mentioned that Shanghai Microelectronics Equipment (Group) Co., Ltd.'s 28nm lithography machine (ArF, Immersion) "has entered the process testing stage." So how well they will do there is still a question.
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