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I am not sure I understand the cause and effect. 20A was cancelled long before Arrow lake was launched. In Fact it was cancelled internally at least by Feb 2024 and not admitted publicly until Sept 2024. Meteor lake and Arrow lake are just not real good products. Lunar lake is very good (ironic...
LBT put in the correct culture and CEO behavior. Now lets see Intel start growing again and gaining market share. Revenue is down significantly since 2020 and everyone else grew a huge amount.
Exactly. Decide what you are going to do and live with the consequences. If you want datacenters, build them. If you don't, then other countries can build them and they can control datacenters.
The US decided not to build nuclear plants and not to dam rivers over the last 30 years. Thats...
Great website: It is now growing at 1.7%. It is projected to grow at 2.5% annually through 2035 IF we build all the datacenters.
Seems Doable.... IF we want it.
Do we want more electricity in the US or not? Do we want to ban Datacenters or not. Do we want nuclear or not? Do we want to shut...
Great Comment. I agree on need for 20A. And reasons for not ramping it
I just respond to what the IFS people said to us. I think @Scotten Jones had some comments on the whole BSPD as well. If 18A was not great for external, then those "we were misled" lawsuits were correct.
2028 is not likely...
IMHO, Given the balance sheet challenges when he took over (Which mant people did not realize), it is amazing what he accomplished in 9 months. Intel stockholders should be incredibly thankful. Now to see if he can get Intel revenue back to where it was 5 years ago.
I am not sure what this ("Domestic") means:
Micron makes vast majority of HBM in Asia. DRAM Wafers and packaging
All of the HBM units are shipped to Asia for adding to systems. There is no significant GPU assembly or packaging in the US today. Not sure what "domestic demand" means.
Micron...
the revisionist history is quite stunning here.
2021: 18A was the external version of the Internal node. 50 products being testing. Everyone is looking at it. Whales and prepayments coming in. 5B in external foundry revenue in 2026. Fabs planned everywhere
2024: Internal version (20A) is...
Major OSATs can do all advanced packaging and have been proposing it for years.
They are doing subcontracting for some major players today that people do not realize.
two challenges:
1) they need high volume to get the scale they are used to. .... that is coming obviously.
2) The integration...
Silicon photonics was clearly needed and was going to transform datacenters.
.... In 1995, 2005, 2015.
Someday it will take over... today is not that day.
TSMC is not the only company that can provide advanced packaging. Intel is not the only company with EMIB like process.
But the GPU is made by TSMC. So it is easier for them to do it. HBM is made and packaged by memory companies and integrated onto the interposer.
I think the big growth in...
Foundry is external business. Intel External wafer foundry is not top 15 today. Intel external packaging is not top 10 today. The data is published every quarter.
Looking at Internal sales is nonsense for both Intel and Samsung.
And Intel did say they will be #2 EXTERNAL in 2030. They will...
So the first fab is running now at N4 (say 20K+ wafers per month ... or more???).
The second fab will start up on N3 and will have mass production in 2027?
This is all great for the US and Arizona!
The question is "when will Intel be a top 6 external revenue wafer foundry?" and if you like packaging, "when will Intel be a top 10 external OSAT?"
2030? 2032?
