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Inside Intel’s new Arizona fab, where the chipmaker’s fate hangs in the balance

Daniel Nenni said:
No way does TSMC packaging margins align with the corporate 55-60% margin but I'm sure it is more than the 15% industry packaging average. I did hear that TSMC packaging revenue is steadily increasing and may hit 10% of total revenue. CoWos is all the rage these days, especially at N3 and who doesn't use TSMC N3? Go TSMC!
Click to expand...

Doesn't TSMC basically have a captive audience with advanced packaging at this stage? Couldn't they generate a pretty high margin for some of the packaging they do?
 
Xebec said:
Doesn't TSMC basically have a captive audience with advanced packaging at this stage? Couldn't they generate a pretty high margin for some of the packaging they do?
Click to expand...

Does this benefit the paying public who are ultimately the end user.

What is the point for TSMC to completely turn over their customers?

Or they gonna get extra margin out of their own suppliers?

Wouldn't the industry operate better if it was complimentry as opposed to constantly looking to squeeze down?
 
Xebec said:
Doesn't TSMC basically have a captive audience with advanced packaging at this stage? Couldn't they generate a pretty high margin for some of the packaging they do?
Click to expand...
TSMC is not the only company that can provide advanced packaging. Intel is not the only company with EMIB like process.

But the GPU is made by TSMC. So it is easier for them to do it. HBM is made and packaged by memory companies and integrated onto the interposer.

I think the big growth in next 5 years will be the OSAT vendors doing advanced packaging.... including for TSMC customers.
 
MKWVentures said:
TSMC is not the only company that can provide advanced packaging. Intel is not the only company with EMIB like process.

But the GPU is made by TSMC. So it is easier for them to do it. HBM is made and packaged by memory companies and integrated onto the interposer.

I think the big growth in next 5 years will be the OSAT vendors doing advanced packaging.... including for TSMC customers.
Click to expand...
Is advanced packaging basically limited to the "last three standing" foundries (<7nm) at this point, or are there a number of other outfits that can do it (and actually do it for whales like Nvidia?)

Thanks!
 
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