Array
(
    [content] => 
    [params] => Array
        (
            [0] => /forum/threads/tsmcs-back-side-power-supply-a16-is-coming-soon-and-nvidia-is-expected-to-be-the-first-to-adopt-it-despite-the-high-price.23626/
        )

    [addOns] => Array
        (
            [DL6/MLTP] => 13
            [Hampel/TimeZoneDebug] => 1000070
            [SV/ChangePostDate] => 2010200
            [SemiWiki/Newsletter] => 1000010
            [SemiWiki/WPMenu] => 1000010
            [SemiWiki/XPressExtend] => 1000010
            [ThemeHouse/XLink] => 1000970
            [ThemeHouse/XPress] => 1010570
            [XF] => 2021770
            [XFI] => 1050270
        )

    [wordpress] => /var/www/html
)

TSMC's back-side power supply A16 is coming soon, and Nvidia is expected to be the first to adopt it despite the high price.

Daniel Nenni

Admin
Staff member
Entering a golden period of growth, mass production will begin in the second half of next year, and Nvidia is considering introducing
TSMC's A16, which will go into mass production in the second half of next year, will be a significant turning point in TSMC's most advanced manufacturing processes, with AI applications dominating the industry for the first time. (Photo/File photo of this newspaper)
TSMC's A16, which will go into mass production in the second half of next year, will be a significant turning point in TSMC's most advanced manufacturing processes, with AI applications dominating the industry for the first time. (Photo/File photo of this newspaper)

TSMC is entering a golden age of AI growth! With its 2nm process entering mass production, HPC will drive this growth. Industry experts predict that by 2026, not only will major mobile phone manufacturers adopt TSMC's 2nm process, but AMD's 2nm HPC (high-performance computing) chips will also debut next year. Facing competition, supply chain sources indicate that Nvidia is considering adopting TSMC's most advanced process, the A16 (with a back-end powered 2nm process), which will be mass-produced in the second half of next year. This will mark a significant turning point, with AI applications dominating TSMC's cutting-edge processes for the first time.

Industry sources indicate that this marks the second time Nvidia has used TSMC's most advanced process technology for its chips since its previous 0.11-micron process. Analysts are optimistic that AI-related revenue will continue to grow, and that capital expenditures will reach new heights next year to maintain strong 2nm demand.

In the past, smartphones drove growth in advanced manufacturing processes, but competition has intensified in recent years. While market size has remained stable, brands are shifting their focus to peripheral products. For example, Apple has expanded its reach into in-house modems and Wi-Fi chips, such as the C1X (modem) and N1 (wireless network). Supply chain sources reveal that Nvidia is reportedly the first to introduce back-of-chip power technology, following AMD's adoption of 2nm for its Venice CPUs. This technology is expected to be used in future Feynman architectures.

Semiconductor industry analysts say that although 2nm is expensive, with Apple's 2nm chip costing nearly $27,000 each and Nvidia's back-of-chip power supply version costing more than $30,000, the significant increase in performance and chip density makes it the key reason for many customers to "pay for value."

Analysts believe that to ensure the yield of more refined processes, demand for testing and verification will increase, including SLT (system-level testing), AOI (automated optical inspection), and burn-in testing. Previously used primarily for production line monitoring, AOI will be integrated deeper into the wafer manufacturing process, achieving inspection accuracy levels beyond the reach of the naked eye. This will drive demand for related testing equipment, such as those from companies like Maktec and Huayouyi.

The AI era relies on the semiconductor industry, and TSMC has reaped the benefits of AI by leveraging its advantages in mass production and process technology.

It is reported that TSMC's sports meeting this year is scheduled to be held on November 8. At a time when revenue and profits continue to set new highs, it highlights the company's successful overcoming of challenges and creation of miracles.

Changes in TSMC's technology platform revenue shareChanges in TSMC's technology platform revenue share

 
TSMC made A16 for Nvidia so yes they will be first. The hyperscalers will be next. I have not heard anything about AMD designing to BSPD but I am sure they will. The first version of TSMC A14 does not have BSPD but that could change. Nvidia is a big driver of technology.
 
Intel said if they get external customer you will get 14A otherwise it will be cancelled

Intel 14A is not cancelled. At a minimum it will be used internally. From what I hear Intel Foundry has 14A customers in process. Lip-Bu Tan is out working the customers with Kevin O'Buckley, they are a great team. Also, Intel 14A will use HNA-EUV so it could have a density advantage over TSMC A14.

The TSMC Symposium is next week, I will be there, we will know more then. Intel will be the big hallway talk topic, absolutely.

Then there is Rapidus:


Not a word from Samsung of late.
 
Intel 14A is not cancelled. At a minimum it will be used internally. From what I hear Intel Foundry has 14A customers in process. Lip-Bu Tan is out working the customers. Also, Intel 14A will use HNA-EUV so it could have a density advantage over TSMC A14.
I don't think it will have Density advantage over A14 if i have to estimate based on Public Info 18A is similar to N3P in Density and 30% more roughly will land in between N2 and A14 which is decent imo as for High Na only time will tell they also said 14A will have optional High Na.
@Fred Chen doesn't see High-Na Viable unless Intel has some secret sauce they don't want to share.
As for Internal use i agree they can do it in Oregon Dev Fab and will not bring Ohio until they get sufficient capital to bring it online. Maybe whatever comes after Nova Lake will use 14A in 27
 
Last edited:
I don't think it will have Density advantage over A14 if i have to estimate based on Public Info 18A is similar to N3P in Density and 30% more roughly will land in between N2 and A14 which is decent imo as for High Na only time will tell they also said 14A will have optional High Na.
@Fred Chen doesn't see High-Na Viable unless Intel has some secret sauce they don't want to share.
As for Internal use i agree they can do it in Oregon Dev Fab and will not bring Ohio until they get sufficient capital to bring it online. Maybe whatever comes after Nova Lake will use 14A in 27

I was skeptical about HNA-EUV as well but Intel can use it for 2-3 layers using EUV for the rest. If so, Intel can claim first to HNA-EUV which might attract some whales. The egos in this business never cease to amaze me. Everyone wants to be on the latest and greatest process. The difference between Pat Gelsinger and Lip-Bu Tan is that Lip-Bu will not go public about it until deals are signed and risk production has started.
 
Back
Top