Webinar: Multiphysics Simulation of Challenges in 3D IC and Chiplet Designs

Online

Multiple Sessions - All English Language: 14:00 JST (APAC) 10:00 EDT, 16:00 CET (AMER and EUR) Stacking multiple dies with 3D ICs offer enhanced functionality, reduced form factor, and improved interconnect density. However, these advancements come with several challenges, including thermal management issues. Multiphysics suites from Altair assist designers in optimizing thermal management strategies and …

Webinar: Speed Up Your Electronic Component Design with HPC

Online

Electronic components design and their integration on PCBs involve complex simulations to accurately predict EM fields and forces. These simulations can be computationally intensive and time-consuming. High-performance computing (HPC) capability built into Ansys Maxwell core technology significantly accelerates the electronic component design process, enabling quick iteration, optimization, and validation. Maxwell's ECAD capability allows modeling and …