Calendar of Events

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Webinar: Quickly Obtain Accurate Design of Surface Mount Filters with Ansys Nuhertz and Modelithics

4 events,

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Webinar: Master’s Degree in Numerical Simulation with Ansys

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Webinar: An end-to-end functional safety solution for automotive ICs based on ISO 26262

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Webinar: Unlocking Electronics Reliability: An Expert Engineering Panel Discussion on Ansys Sherlock

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Webinar: Simulate analog, RF, memory, and mixed-signal ICs more efficiently

3 events,

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Webinar: From Isolated Simulations to Holistic Workflows: Design of Transcatheter Valve Replacements

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Webinar: Automotive Safety Implementation with Cadence Solutions

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Webinar: Automotive Safety Implementation with Cadence Solutions

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1 event,

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Mastering Gearbox Durability: Advanced Simulation Techniques with Ansys

3 events,

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Webinar: Integrate Analysis into PCB Design with Sigrity X Aurora

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Webinar: Design Efficiency Unlocked: Allegro’s Journey to Cutting Design Time in Half

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Webinar: Using iPegasus DRC/Fill in Virtuoso Studio to improve productivity

1 event,

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Webinar: Trends in Semiconductor System Design

0 events,

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1 event,

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Webinar: Using Quantus Insight for Intelligent Debugging, Optimization, and Signoff Closure

3 events,

Webinar: Optical Sensors for Health Monitoring: Revolutionizing Wearable Devices

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Webinar: Optimizing and Troubleshooting Chemical Process Flow Equipment Using CFD

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Webinar: Addressing Tomorrow’s Automotive Compute Needs with Cadence

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1 event,

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Webinar: Intelligent Material Selection to Meet Engineering Challenges

2 events,

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Webinar: Getting Started with Electrical Constraints in OrCAD X

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Webinar: Accelerating Ansys LS-DYNA Simulations with Reduced Order Modeling and Hybrid Analytics

2 events,

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Webinar: Optimizing and Troubleshooting Particle Processing Equipment using 3D Particle Dynamics DEM Simulation

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Masterclass: Microsoft Focus on IP QA with Solido IP Validation Suite

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1 event,

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Webinar: Overcome Nuclear Power Plant Life Extension Challenges with Simulation

2 events,

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Webinar: The Impact on the Automotive Market as Chips Transform Into 3D Systems

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CadenceTECHTALK: Addressing Thermal Design Challenges with In-Design Analysis

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