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Summary Join us for a weekly webinar series focusing on cutting-edge design and implementation techniques for hardware security. This series is perfect for engineers and designers looking to strengthen their …
Package reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability of the circuit. Today, reliability can involve tradeoffs between performance and reliability; assessing the impact of …
The challenges before semiconductor fabs are expansive and evolving. As the size of chips shrinks from nanometers to eventually angstroms, the complexity of the manufacturing process increases in response. To …
Summary Join us for a weekly webinar series focusing on cutting-edge design and implementation techniques for hardware security. This series is perfect for engineers and designers looking to strengthen their knowledge, stay current with the latest hardware security advancements and learn more about security IP solutions. Each week, we will explore a critical topic in …
About Silicon photonics systems integrate photonic components such as optical waveguides, couplers, resonators, photodetectors, etc. along with electronic components on the same silicon chip to realize high-bandwidth, high-density, and low-power …
As AI models’ demand for computational power escalates at an unprecedented rate, the demand for high-speed, efficient, and low-power solutions has never been greater. This Synopsys webinar will explore the …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's microprocessor chips have one thousand times the processing power of those a decade ago. These challenges have been accomplished because of the integrated circuit industry's ability to track something known as Moore's Law. Moore's Law states that an integrated circuit's …
Join us for an in-depth, hands-on workshop on Electromagnetic Compatibility (EMC) simulation, designed to help engineers integrate powerful simulation tools into their workflow for improved product design and regulatory compliance. …
Learn how to design lighter, stronger, and more efficient structures using advanced optimization techniques. Ideal for teams aiming to excel in engineering competitions, this webinar will equip teams with the …
Improve your student team’s use of CFD by learning best practices in properly setting up, running, and validating results and learning common mistakes made in CFD for your team to …
Join us for an in-depth exploration of our advanced NVH (Noise, vibration, and harshness) solutions. This webinar will showcase Ansys's advanced technologies and tools to help engineers tackle complex NVH …
Join us as we delve into the simulation of the dark count rate (DCR) in silicon SPADs using Ansys Lumerical CHARGE. Participants will learn about the workflow for simulating the electric field and thermal generation rates, followed by calculating the avalanche triggering probability and DCR. TIME: AUGUST 22, 2024 SESSION 1: 9:00 AM EDT SESSION …
Synopsys Webinar | Thursday, August 22, 2024 | 10:00 - 10:40 a.m. PT Join us for an exclusive Synopsys Cloud webinar highlighting the benefits of license management automation. Synopsys Cloud offers hassle-free EDA license management for chip design teams whether EDA tools are run on their own compute farms, in a cloud environment (from any …
Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and the system level interconnection; 2) chemical, environmental and mechanical protection; 3) heat transfer; 4) power, ground and signal distribution between the die and system; 5) …
Join us and discover how Autodesk Fusion and Ansys are transforming how consumer products are designed, putting you at the forefront of innovation and giving your creations the competitive edge they deserve. TIME: August 28, 2024 12 PM EDT / 9 AM PT Venue: Virtual Overview Imagine designing the next generation of consumer electronics, smart …