Learn about the latest improvements and new features to the high frequency electronics simulation tools. There are many enhancements for engineers involved in RF, automotive, A&D, and consumer electronics designs that our subject matter experts will discuss. TIME: APRIL 9, 2024 11 AM EDT / 5 PM CEST / 8:30 PM IST Venue: Virtual Overview …
Continue reading "Ansys 2024 R1: High Frequency Electronics What’s New"
Managing the thermal aspects of electronics to avoid excessive heat buildup has a direct impact on reliability. By conducting thorough thermal analysis early in the design processes, engineers can identify problematic hot spots and optimize the appropriate heat dissipation mechanisms to ensure components operate in an appropriate temperature range. Avoiding excessive heat buildup helps ensure …
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A worldwide connected Event !! D&R IP-SoC Silicon Valley 2024 Day is the unique worldwide Spring event fully dedicated to IP (Silicon Intellectual Property) and IP based Electronic Systems. IP-SoC …
SEMICON West brings the incredibly diverse global electronics supply chain together to address the semiconductor ecosystem’s greatest opportunities and challenges through programs highlighting Market Intelligence | Standards | Sustainability | Workforce Development | SEMI University | Supply Chain Management | and …
About The Conference We are delighted to announce the AESIN Conference 2024 to be held on 11th July. This year’s AESIN theme is Collaboration in a technology rich era. We will be celebrating UK’s outstanding automotive electronics related organisations as we bring technology to the forefront. Come together with fellow industry leaders and experts as …
Join us for an exclusive webinar during Ansys 2024 R2 updates. We'll showcase significant enhancements to our Thermal Integrity tools. Discover the latest in Icepak, Mechanical Thermal, and Mechanical Structural, …
Continue reading "Ansys 2024 R2: Thermal Integrity in the Ansys Electronics Desktop Update"
The Future of Electronics RESHAPED Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid, Wearable, Structural, and 3D. Join the flagship TechBlick event and the global …
