Webinar: Chip-Level Electromagnetic Crosstalk Signoff Using EMX Solver

Online

Description Today’s wireless and high-speed chip designs integrate an incredible amount of functionality on very small silicon real estate. Such integration requires optimization from the early stages of the design to post-layout vs. schematic (LVS) signoff. Increasingly complex designs and advanced process nodes test the limits of electromagnetic (EM) solvers in terms of modeling capacity …