Webinar: Thermal Solutions for Electronics Design

Online

Managing the thermal aspects of electronics to avoid excessive heat buildup has a direct impact on reliability. By conducting thorough thermal analysis early in the design processes, engineers can identify problematic hot spots and optimize the appropriate heat dissipation mechanisms to ensure components operate in an appropriate temperature range. Avoiding excessive heat buildup helps ensure …

Masterclass: Deploying Solido Design Environment AI Workflows on AWS

Online

Utilizing AWS cloud resources to accelerate variation-aware verification   AI-powered Solido Design Environment provides SPICE-accurate variation-aware verification for 3, 4, 5, 6 and higher sigma targets, orders of magnitude faster than traditional brute-force methods. With cloud computing made more accessible than before, many teams are considering running design and verification workloads, including Solido Design Environment, on …

DVCon Japan 2024

Shinagawa, Tokyo, Japan Shinagawa, Tokyo, Japan

The Design & Verification Conference & Exhibition is the premier conference on the application of languages, tools, methodologies, and standards for the design and verification of electronic systems and integrated …