In the fast-evolving world of monolithic microwave integrated circuit (MMIC) design, meeting higher-frequency requirements is just the beginning. Are you seeking insights on achieving dimensional accuracy for both analog and …
Managing the thermal aspects of electronics to avoid excessive heat buildup has a direct impact on reliability. By conducting thorough thermal analysis early in the design processes, engineers can identify …
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DATE: Wednesday, April 24 TIME: 8:00am PDT | 11:00am EDT | 4:00pm BST | 8:30pm IST PSpice is a high-performance, industry-proven, mixed-signal simulator and waveform viewer for analog and mixed-signal circuits. As one of …
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Utilizing AWS cloud resources to accelerate variation-aware verification AI-powered Solido Design Environment provides SPICE-accurate variation-aware verification for 3, 4, 5, 6 and higher sigma targets, orders of magnitude faster than …
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(Work email required for verified registration) During a project, subsystem and full-chip integration plays a crucial role. Integration can be particularly challenging on large SoCs with distributed teams due to complexity of the integration process, multi-site infrastructure issues, as well as the need to collaborate across multiple time zones. Often, integrators must integrate design blocks …
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Date: Tuesday, May 14, 2024 Venue: Hilton Dresden Location: An der Frauenkirche 5, 01067 Dresden, Germany Parking: There is parking at the hotel with a charge of €28 per day. You will receive further information in your registration confirmation email. Analog, RF, and Mixed-Signal IC Design Learn how the latest developments within Virtuoso Studio and Spectre platforms can significantly …
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Helping students understand the underlying physics that connects antenna performance, array implementation, and prediction of its behavior is featured in this upcoming webinar on Ansys Electronics Desktop. TIME: JUNE 18, …
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AI-Powered Engineering for Design, Simulation, and Manufacturing Are you ready to unlock the full potential of artificial intelligence (AI) in engineering? The ATCx AI for Engineers virtual global event brings together design, …
Electronic components design and their integration on PCBs involve complex simulations to accurately predict EM fields and forces. These simulations can be computationally intensive and time-consuming. High-performance computing (HPC) capability built into Ansys Maxwell core technology significantly accelerates the electronic component design process, enabling quick iteration, optimization, and validation. Maxwell's ECAD capability allows modeling and …
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Ensuring my Design Verification is ISO26262 Compliant With the widespread of the modern automobiles, run and regulated by automotive ECUs, the need for advanced safety features has also become inevitable. And this is why today modern vehicles are required to adhere to the safety standards listed within the Automotive Safety Integrity Level (ASIL). In this …
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The digital chip design flow carries with it an enormous wealth of untapped information regarding the health and status of your SoC design. The ability to efficiently mine this data provides chip designers with comprehensive visibility and actionable insights to uncover PPA opportunities. This webinar will introduce you to Synopsys Design.da, the industry’s first comprehensive data-visibility …
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The Design & Verification Conference & Exhibition is the premier conference on the application of languages, tools, methodologies, and standards for the design and verification of electronic systems and integrated …
