Webinar: Speed Up Your Electronic Component Design with HPC

Online

Electronic components design and their integration on PCBs involve complex simulations to accurately predict EM fields and forces. These simulations can be computationally intensive and time-consuming. High-performance computing (HPC) capability built into Ansys Maxwell core technology significantly accelerates the electronic component design process, enabling quick iteration, optimization, and validation. Maxwell's ECAD capability allows modeling and …

Ansys 2024 R2: Thermal Integrity in the Ansys Electronics Desktop Update

Online

Join us for an exclusive webinar during Ansys 2024 R2 updates. We'll showcase significant enhancements to our Thermal Integrity tools. Discover the latest in Icepak, Mechanical Thermal, and Mechanical Structural, with expanded capabilities. TIME: JULY 18, 2024 11 AM EDT Venue: Virtual Overview This Ansys 2024 R2 webinar reviews the updates, enhancements, and new features …